Keitaro ICHIKAWA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device and manufacturing method thereof
- Patent number 11,735,509
- Issue date Aug 22, 2023
- Mitsubishi Electric Corporation
- Keitaro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having inner lead exposed from sealing resin,...
- Patent number 11,652,032
- Issue date May 16, 2023
- Mitsubishi Electric Corporation
- Keitaro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer-mold type power module and lead frame
- Patent number 11,335,629
- Issue date May 17, 2022
- Mitsubishi Electric Corporation
- Fumihito Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, power conversion device, and method for ma...
- Patent number 11,244,836
- Issue date Feb 8, 2022
- Mitsubishi Electric Corporation
- Keitaro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing resin-sealed power semiconductor device
- Patent number 10,930,523
- Issue date Feb 23, 2021
- Mitsubishi Electric Corporation
- Keitaro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,074,598
- Issue date Sep 11, 2018
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,627,302
- Issue date Apr 18, 2017
- Mitsubishi Electric Corporation
- Keitaro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20240266194
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Ken SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335480
- Publication date Oct 19, 2023
- Mitsubishi Electric Corporation
- Keitaro ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230163037
- Publication date May 25, 2023
- Mitsubishi Electric Corporation
- Ken SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163051
- Publication date May 25, 2023
- Mitsubishi Electric Corporation
- Kazuki KODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AN...
- Publication number 20220108941
- Publication date Apr 7, 2022
- Mitsubishi Electric Corporation
- Keitaro ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER-MOLD TYPE POWER MODULE AND LEAD FRAME
- Publication number 20210249341
- Publication date Aug 12, 2021
- Mitsubishi Electric Corporation
- Fumihito KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200303295
- Publication date Sep 24, 2020
- Mitsubishi Electric Corporation
- Keitaro ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, POWER CONVERSION DEVICE, AND METHOD FOR MA...
- Publication number 20200303215
- Publication date Sep 24, 2020
- Mitsubishi Electric Corporation
- Keitaro ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING RESIN-SEALED POWER SEMICONDUCTOR DEVICE
- Publication number 20190051539
- Publication date Feb 14, 2019
- Mitsubishi Electric Corporation
- Keitaro ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170345742
- Publication date Nov 30, 2017
- Mitsubishi Electric Corporation
- Ken SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20160233151
- Publication date Aug 11, 2016
- Mitsubishi Electric Corporation
- Keitaro ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Keitaro ICHIKAWA

Person

Patents Grantslast 30 patents

Power semiconductor device and manufacturing method thereof

Semiconductor device having inner lead exposed from sealing resin,...

Transfer-mold type power module and lead frame

Semiconductor apparatus, power conversion device, and method for ma...

Method for manufacturing resin-sealed power semiconductor device

Semiconductor device and manufacturing method thereof

Power semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AN...

TRANSFER-MOLD TYPE POWER MODULE AND LEAD FRAME

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR APPARATUS, POWER CONVERSION DEVICE, AND METHOD FOR MA...

METHOD FOR MANUFACTURING RESIN-SEALED POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR DEVICE