TREA

Keith A. Snyder

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  • Vestal, NY, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    High density circuit board and method of making same
    • Patent number 5,191,174
    • Issue date Mar 2, 1993
    • International Business Machines Corporation
    • Chi S. Chang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of forming a hybrid printed circuit board
    • Patent number 5,097,593
    • Issue date Mar 24, 1992
    • International Business Machines Corporation
    • Alan L. Jones
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Coaxial cable connector assembly
    • Patent number 5,046,966
    • Issue date Sep 10, 1991
    • International Business Machines Corporation
    • Keith A. Snyder
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit board
    • Patent number 4,927,983
    • Issue date May 22, 1990
    • International Business Machines Corporation
    • Alan L. Jones
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Tape automated bonding package
    • Patent number 4,829,405
    • Issue date May 9, 1989
    • International Business Machines Corporation
    • Keith A. Snyder
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Providing circuit lines on a substrate
    • Patent number 4,690,833
    • Issue date Sep 1, 1987
    • International Business Machines Corporation
    • William A. Donson
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Process for making multilayer integrated circuit substrate
    • Patent number 4,386,116
    • Issue date May 31, 1983
    • International Business Machines Corporation
    • Krishna K. Nair
    • H01 - BASIC ELECTRIC ELEMENTS