Keith E. Downes

Person

Jericho, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual-damascene process to fabricate thick wire structure
- Patent number 9,171,778
- Issue date Oct 27, 2015
- GlobalFoundries U.S. 2 LLC
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene process to fabricate thick wire structure
- Patent number 8,753,950
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for single and multiple level metal-insulator-metal integra...
- Patent number 8,435,864
- Issue date May 7, 2013
- International Business Machines Corporation
- Anil K. Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene process to fabricate thick wire structure
- Patent number 8,236,663
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for creation of a metal insulator metal capacitor
- Patent number 8,227,849
- Issue date Jul 24, 2012
- International Business Machines Corporation
- Ebenezer E. Eshun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for single and multiple level metal-insulator-metal integra...
- Patent number 8,207,568
- Issue date Jun 26, 2012
- International Business Machines Corporation
- Anil K. Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of integration of a MIM capacitor with a lower plate of meta...
- Patent number 7,915,134
- Issue date Mar 29, 2011
- International Business Machines Corporation
- Anil Kumar Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a precision buried resistor
- Patent number 7,910,450
- Issue date Mar 22, 2011
- International Business Machines Corporation
- Anil K. Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal seed layer deposition
- Patent number 7,879,716
- Issue date Feb 1, 2011
- International Business Machines Corporation
- Steven P Barkyoumb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for creation of a metal insulator metal capacitor
- Patent number 7,728,372
- Issue date Jun 1, 2010
- International Business Machines Corporation
- Ebenezer E. Eshun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene process to fabricate thick wire structure
- Patent number 7,602,068
- Issue date Oct 13, 2009
- International Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of a MIM capacitor with a plate formed in a well region...
- Patent number 7,361,950
- Issue date Apr 22, 2008
- International Business Machines Corporation
- Anil Kumar Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal seed layer deposition
- Patent number 7,235,487
- Issue date Jun 26, 2007
- International Business Machines Corporation
- Steven P Barkyoumb
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE
- Publication number 20140151899
- Publication date Jun 5, 2014
- International Business Machines Corporation
- Douglas D. COOLBAUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE
- Publication number 20120190164
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR SINGLE AND MULTIPLE LEVEL METAL-INSULATOR-METAL INTEGRA...
- Publication number 20120184081
- Publication date Jul 19, 2012
- International Business Machines Corporation
- Anil K. CHINTHAKINDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A PRECISION BURIED RESISTOR
- Publication number 20110108919
- Publication date May 12, 2011
- International Business Machines Corporation
- Anil K. Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR CREATION OF A METAL INSULATOR METAL CAPACITOR
- Publication number 20100149723
- Publication date Jun 17, 2010
- International Business Machines Corporation
- EBENEZER E. ESHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE
- Publication number 20100009509
- Publication date Jan 14, 2010
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Integration of a MIM Capacitor with a Lower Plate of Meta...
- Publication number 20090004809
- Publication date Jan 1, 2009
- International Business Machines Corporation
- Anil Kumar Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR CREATION OF A METAL INSULATOR METAL CAPACITOR
- Publication number 20070262416
- Publication date Nov 15, 2007
- International Business Machines Corporation
- Ebenezer E. Eshun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A PRECISION BURIED RESISTOR
- Publication number 20070194390
- Publication date Aug 23, 2007
- Anil K. Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE
- Publication number 20070190718
- Publication date Aug 16, 2007
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SEED LAYER DEPOSITION
- Publication number 20070155164
- Publication date Jul 5, 2007
- Steven P. Barkyoumb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR SINGLE AND MULTIPLE LEVEL METAL-INSULATOR-METAL INTEGRA...
- Publication number 20070065966
- Publication date Mar 22, 2007
- International Business Machines Corporation
- Anil K. Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF A MIM CAPACITOR OVER A METAL GATE OR SILICIDE WITH H...
- Publication number 20070057343
- Publication date Mar 15, 2007
- International Business Machines Corporation
- Anil Kumar Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SEED LAYER DEPOSITION
- Publication number 20050253265
- Publication date Nov 17, 2005
- International Business Machines Corporation
- Steven P. Barkyoumb
- H01 - BASIC ELECTRIC ELEMENTS

Keith E. Downes

Person

Patents Grantslast 30 patents

Dual-damascene process to fabricate thick wire structure

Dual-damascene process to fabricate thick wire structure

Process for single and multiple level metal-insulator-metal integra...

Dual-damascene process to fabricate thick wire structure

Method and structure for creation of a metal insulator metal capacitor

Process for single and multiple level metal-insulator-metal integra...

Method of integration of a MIM capacitor with a lower plate of meta...

Method of fabricating a precision buried resistor

Metal seed layer deposition

Method and structure for creation of a metal insulator metal capacitor

Dual-damascene process to fabricate thick wire structure

Integration of a MIM capacitor with a plate formed in a well region...

Metal seed layer deposition

Patents Applicationslast 30 patents

DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE

DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE

PROCESS FOR SINGLE AND MULTIPLE LEVEL METAL-INSULATOR-METAL INTEGRA...

METHOD OF FABRICATING A PRECISION BURIED RESISTOR

METHOD AND STRUCTURE FOR CREATION OF A METAL INSULATOR METAL CAPACITOR

DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE

Method of Integration of a MIM Capacitor with a Lower Plate of Meta...

METHOD AND STRUCTURE FOR CREATION OF A METAL INSULATOR METAL CAPACITOR

METHOD OF FABRICATING A PRECISION BURIED RESISTOR

DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE

METAL SEED LAYER DEPOSITION

PROCESS FOR SINGLE AND MULTIPLE LEVEL METAL-INSULATOR-METAL INTEGRA...

INTEGRATION OF A MIM CAPACITOR OVER A METAL GATE OR SILICIDE WITH H...

METAL SEED LAYER DEPOSITION