Keith G. Spanjer

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for improving the adhesion of a plastic encapsulant to coppe...
- Patent number 4,946,518
- Issue date Aug 7, 1990
- Motorola, Inc.
- Keith G. Spanjer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laser markable molding compound
- Patent number 4,753,863
- Issue date Jun 28, 1988
- Motorola Inc.
- Keith G. Spanjer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Laser markable molding compound, method of use and device therefrom
- Patent number 4,654,290
- Issue date Mar 31, 1987
- Motorola, Inc.
- Keith G. Spanjer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device including plateless package fabrication method
- Patent number 4,631,805
- Issue date Dec 30, 1986
- Motorola Inc.
- Dennis R. Olsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying material to a semiconductor wafer
- Patent number 4,627,988
- Issue date Dec 9, 1986
- Motorola Inc.
- Keith G. Spanjer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating and marking electronic devices
- Patent number 4,595,647
- Issue date Jun 17, 1986
- Motorola, Inc.
- Keith G. Spanjer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of fabricating a high current package with multi-level leads
- Patent number 4,589,195
- Issue date May 20, 1986
- Motorola, Inc.
- Jerry M. Du Bois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated semiconductor power device
- Patent number 4,583,283
- Issue date Apr 22, 1986
- Motorola, Inc.
- Jerry M. Dubois
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device including plateless package
- Patent number 4,546,374
- Issue date Oct 8, 1985
- Motorola Inc.
- Dennis R. Olsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current package with multi-level leads
- Patent number 4,518,982
- Issue date May 21, 1985
- Motorola, Inc.
- Jerry M. Du Bois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated semiconductor power device
- Patent number 4,510,519
- Issue date Apr 9, 1985
- Motorola, Inc.
- Jerry M. Dubois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder system
- Patent number 4,170,472
- Issue date Oct 9, 1979
- Motorola, Inc.
- Dennis R. Olsen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective coating for high voltage devices
- Patent number 4,096,521
- Issue date Jun 20, 1978
- Motorola Inc.
- Keith Gordon Spanjer
- H01 - BASIC ELECTRIC ELEMENTS

Keith G. Spanjer

Person

Patents Grantslast 30 patents

Method for improving the adhesion of a plastic encapsulant to coppe...

Laser markable molding compound

Laser markable molding compound, method of use and device therefrom

Semiconductor device including plateless package fabrication method

Method for applying material to a semiconductor wafer

Method for encapsulating and marking electronic devices

Method of fabricating a high current package with multi-level leads

Electrically isolated semiconductor power device

Semiconductor device including plateless package

High current package with multi-level leads

Electrically isolated semiconductor power device

Solder system

Protective coating for high voltage devices