Keith Kwong Hon Wong

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device exhibiting reduced parasitics and method for m...
- Patent number 9,276,079
- Issue date Mar 1, 2016
- GLOBALFOUNDRIES Inc.
- Bruce B. Doris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio electroplated metal feature and method
- Patent number 7,951,714
- Issue date May 31, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Silicon on insulator devices having body-tied-to-source and methods...
- Patent number 7,518,191
- Issue date Apr 14, 2009
- International Business Machines Corporation
- Thomas Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper contact via structure using hybrid barrier layer
- Patent number 7,498,256
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Randolph F. Knarr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on insulator devices having body-tied-to-source and methods...
- Patent number 7,442,614
- Issue date Oct 28, 2008
- International Business Machines Corporation
- Thomas Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for generating alignment marks for manufacturing MIM capacitors
- Patent number 6,750,115
- Issue date Jun 15, 2004
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH ASPECT RATIO ELECTROPLATED METAL FEATURE AND METHOD
- Publication number 20100143649
- Publication date Jun 10, 2010
- International Business Machines Corporation
- Daniel C. Edelstein
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Micro-cavity MEMS device and method of fabricating same
- Publication number 20070046392
- Publication date Mar 1, 2007
- International Business Machines Corporation
- Louis C. Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for forming slot via bitline for MRAM devices
- Publication number 20070023806
- Publication date Feb 1, 2007
- International Business Machines Corporation
- Michael C. Gaidis
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method for adjusting capacitance of an on-chip capacitor
- Publication number 20050128682
- Publication date Jun 16, 2005
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ADJUSTING CAPACITANCE OF AN ON-CHIP CAPACITOR
- Publication number 20050070127
- Publication date Mar 31, 2005
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM capacitor structures and fabrication methods in dual-damascene...
- Publication number 20040056324
- Publication date Mar 25, 2004
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS

Keith Kwong Hon Wong

Person

Patents Grantslast 30 patents

Semiconductor device exhibiting reduced parasitics and method for m...

High aspect ratio electroplated metal feature and method

Silicon on insulator devices having body-tied-to-source and methods...

Copper contact via structure using hybrid barrier layer

Silicon on insulator devices having body-tied-to-source and methods...

Method for generating alignment marks for manufacturing MIM capacitors

Patents Applicationslast 30 patents

HIGH ASPECT RATIO ELECTROPLATED METAL FEATURE AND METHOD

Micro-cavity MEMS device and method of fabricating same

Method and structure for forming slot via bitline for MRAM devices

Method for adjusting capacitance of an on-chip capacitor

METHOD FOR ADJUSTING CAPACITANCE OF AN ON-CHIP CAPACITOR

MIM capacitor structures and fabrication methods in dual-damascene...