Keith L. Barrie

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Capitola, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,508,689
- Issue date Nov 29, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,153,517
- Issue date Oct 6, 2015
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die having fine pitch electrical interconnects
- Patent number 8,829,677
- Issue date Sep 9, 2014
- Invensas Corporation
- Keith Lake Barrie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTOR BETWEEN DIE PAD AND Z-INTERCONNECT FOR STACKED...
- Publication number 20160027761
- Publication date Jan 28, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Having Fine Pitch Electrical Interconnects
- Publication number 20150056753
- Publication date Feb 26, 2015
- Invensas Corporation
- Keith Lake Barrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die having fine pitch electrical interconnects
- Publication number 20120248607
- Publication date Oct 4, 2012
- Vertical Circuits, Inc.
- Keith Lake Barrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connector Between Die Pad and Z-Interconnect for Stacked...
- Publication number 20120119385
- Publication date May 17, 2012
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS