Keith M. Edwards

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with multiple stacked leadframes and a method...
- Patent number 10,276,477
- Issue date Apr 30, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a leadframe for semiconductor devices
- Patent number 7,001,799
- Issue date Feb 21, 2006
- Amkor Technology, Inc.
- Keith M. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package for semiconductor devices
- Patent number 6,844,615
- Issue date Jan 18, 2005
- Amkor Technology, Inc.
- Keith M. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package for semiconductor devices
- Patent number 6,794,740
- Issue date Sep 21, 2004
- Amkor Technology, Inc.
- Keith M. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making two lead surface mounting high power microleadframe semicond...
- Patent number 6,756,658
- Issue date Jun 29, 2004
- Amkor Technology, Inc.
- Blake A. Gillett
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTIPLE STACKED LEADFRAMES AND A METHOD...
- Publication number 20190181077
- Publication date Jun 13, 2019
- UTAC Headquarters Pte. Ltd.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS