Keizo Takemiya

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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin molding material for sealing and electronic component d...
- Patent number 10,662,315
- Issue date May 26, 2020
- Hitachi Chemical Company, Ltd.
- Mitsuyoshi Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant epoxy resin composition and electronic device
- Patent number 6,372,351
- Issue date Apr 16, 2002
- Hitachi Chemical Company, Ltd.
- Keizo Takemiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...
- Publication number 20170121505
- Publication date May 4, 2017
- Hitachi Chemical Company, Ltd.
- Mitsuyoshi Hamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...
- Publication number 20140128505
- Publication date May 8, 2014
- HITACHI CHEMICAL COMPANY, LTD.
- Mitsuyoshi Hamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...