Kejun Zeng

Person

Coppell, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Corrosion-resistant copper bonds to aluminum
- Patent number 9,646,950
- Issue date May 9, 2017
- Texas Instruments Incorporated
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stable gold bump solder connections
- Patent number 7,939,939
- Issue date May 10, 2011
- Texas Instruments Incorporated
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure to reduce risk of gold embrittlement in solder...
- Patent number 7,291,549
- Issue date Nov 6, 2007
- Texas Instruments Incorporated
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joints for copper metallization having reduced interfacial v...
- Patent number 7,267,861
- Issue date Sep 11, 2007
- Texas Instruments Incorporated
- Darvin R. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of semiconductor device assembly including fatigue-resistant...
- Patent number 7,070,088
- Issue date Jul 4, 2006
- Texas Instruments Incorporated
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure to reduce risk of gold embrittlement in solder...
- Patent number 7,005,745
- Issue date Feb 28, 2006
- Texas Instruments Incorporated
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlling interdiffusion rates in metal interconnection structures
- Patent number 6,867,503
- Issue date Mar 15, 2005
- Texas Instruments Incorporated
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CORROSION-RESISTANT COPPER BONDS TO ALUMINUM
- Publication number 20160181225
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION-RESISTANT COPPER-TO-ALUMINUM BONDS
- Publication number 20120001336
- Publication date Jan 5, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Kejun ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stable Gold Bump Solder Connections
- Publication number 20110177686
- Publication date Jul 21, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STABLE GOLD BUMP SOLDER CONNECTIONS
- Publication number 20110108980
- Publication date May 12, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromigration-Resistant Flip-Chip Solder Joints
- Publication number 20100219528
- Publication date Sep 2, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Jie-Hua ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Reliable Solder Joints
- Publication number 20090297879
- Publication date Dec 3, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kejun ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stable Gold Bump Solder Connections
- Publication number 20090091024
- Publication date Apr 9, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromigration-Resistant Flip-Chip Solder Joints
- Publication number 20080251927
- Publication date Oct 16, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gold-Tin Solder Joints Having Reduced Embrittlement
- Publication number 20080083993
- Publication date Apr 10, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder joints for copper metallization having reduced interfacial v...
- Publication number 20060267157
- Publication date Nov 30, 2006
- Darvin R. Edwards
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and structure to reduce risk of gold embrittlement in solder...
- Publication number 20060097398
- Publication date May 11, 2006
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal fatigue resistant tin-lead-silver solder
- Publication number 20060038302
- Publication date Feb 23, 2006
- Kejun Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pre-doped reflow interconnections for copper pads
- Publication number 20050275096
- Publication date Dec 15, 2005
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of semiconductor device assembly including fatigue-resistant...
- Publication number 20050199684
- Publication date Sep 15, 2005
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure to reduce risk of gold embritlement in solder...
- Publication number 20050161829
- Publication date Jul 28, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection site coating method and solder joints
- Publication number 20050072834
- Publication date Apr 7, 2005
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Controlling interdiffusion rates in metal interconnection structures
- Publication number 20040222532
- Publication date Nov 11, 2004
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Corrosion-resistant copper bonds to aluminum

Stable gold bump solder connections

Method and structure to reduce risk of gold embrittlement in solder...

Solder joints for copper metallization having reduced interfacial v...

Method of semiconductor device assembly including fatigue-resistant...

Method and structure to reduce risk of gold embrittlement in solder...

Controlling interdiffusion rates in metal interconnection structures

Patents Applicationslast 30 patents

CORROSION-RESISTANT COPPER BONDS TO ALUMINUM

CORROSION-RESISTANT COPPER-TO-ALUMINUM BONDS

Stable Gold Bump Solder Connections

STABLE GOLD BUMP SOLDER CONNECTIONS

Electromigration-Resistant Flip-Chip Solder Joints

Structure and Method for Reliable Solder Joints

Stable Gold Bump Solder Connections

Electromigration-Resistant Flip-Chip Solder Joints

Gold-Tin Solder Joints Having Reduced Embrittlement

Solder joints for copper metallization having reduced interfacial v...

Method and structure to reduce risk of gold embrittlement in solder...

Thermal fatigue resistant tin-lead-silver solder

Pre-doped reflow interconnections for copper pads

Method of semiconductor device assembly including fatigue-resistant...

Method and structure to reduce risk of gold embritlement in solder...

Connection site coating method and solder joints

Controlling interdiffusion rates in metal interconnection structures