Kelly M. Lear

Person

Longwood, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
System in package with flip chip die over multi-layer heatsink stan...
- Patent number 12,334,413
- Issue date Jun 17, 2025
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactance cancelling radio frequency circuit array
- Patent number 12,230,895
- Issue date Feb 18, 2025
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package with flip chip die over multi-layer heatsink stan...
- Patent number 11,942,391
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk acoustic wave resonator stacked onto an integrated passive device
- Patent number 11,923,827
- Issue date Mar 5, 2024
- Qorvo US, Inc.
- Jeffery D. Galipeau
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Reactance cancelling radio frequency circuit array
- Patent number 11,705,633
- Issue date Jul 18, 2023
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with embedded active thermoelectric cooler
- Patent number 11,551,995
- Issue date Jan 10, 2023
- Qorvo US, Inc.
- Mark C. Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shields with bonding wires for sub-modules
- Patent number 11,515,282
- Issue date Nov 29, 2022
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shields for sub-modules
- Patent number 11,219,144
- Issue date Jan 4, 2022
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shields for sub-modules
- Patent number 11,058,038
- Issue date Jul 6, 2021
- Qorvo US, Inc.
- Kelly M. Lear
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High isolation duplexer/quasi circulator with two quadrature couplers
- Patent number 10,686,485
- Issue date Jun 16, 2020
- Qorvo US, Inc.
- Kelly M. Lear
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High power and low loss acoustic filter
- Patent number 10,277,198
- Issue date Apr 30, 2019
- Qorvo US, Inc.
- Kelly M. Lear
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SIP MODULE WITH STILTED INTERCONNECTS
- Publication number 20250183183
- Publication date Jun 5, 2025
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER ELECTRICAL STRUCTURES
- Publication number 20250081339
- Publication date Mar 6, 2025
- Qorvo US, Inc.
- Jerry Holt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-REJECTION/HIGH-ISOLATION MODULE WITH EXTERNAL GROUND RE-REFERE...
- Publication number 20250079417
- Publication date Mar 6, 2025
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC FILTERS WITH IMPROVED RETURN LOSS
- Publication number 20240195381
- Publication date Jun 13, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...
- Publication number 20240178096
- Publication date May 30, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER WITH IMPROVED HARMONIC TERMINATION
- Publication number 20240128937
- Publication date Apr 18, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
REACTANCE CANCELLING RADIO FREQUENCY CIRCUIT ARRAY
- Publication number 20230318179
- Publication date Oct 5, 2023
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTANCE CANCELLING RADIO FREQUENCY CIRCUIT ARRAY
- Publication number 20230187826
- Publication date Jun 15, 2023
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...
- Publication number 20230170275
- Publication date Jun 1, 2023
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES
- Publication number 20230075555
- Publication date Mar 9, 2023
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR STACKED ONTO AN INTEGRATED PASSIVE DEVICE
- Publication number 20220271736
- Publication date Aug 25, 2022
- Qorvo US, Inc.
- Jeffery D. Galipeau
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES
- Publication number 20200373273
- Publication date Nov 26, 2020
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDS FOR SUB-MODULES
- Publication number 20200305314
- Publication date Sep 24, 2020
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ISOLATION DUPLEXER/QUASI CIRCULATOR WITH TWO QUADRATURE COUPLERS
- Publication number 20200186184
- Publication date Jun 11, 2020
- Qorvo US, Inc.
- Kelly M. Lear
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTROMAGNETIC SHIELDS FOR SUB-MODULES
- Publication number 20200008327
- Publication date Jan 2, 2020
- Qorvo US, Inc.
- Kelly M. Lear
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH EMBEDDED ACTIVE THERMOELECTRIC COOLER
- Publication number 20190131209
- Publication date May 2, 2019
- Qorvo US, Inc.
- Mark C. Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER AND LOW LOSS ACOUSTIC FILTER
- Publication number 20170244382
- Publication date Aug 24, 2017
- Qorvo US, Inc.
- Kelly M. Lear
- H03 - BASIC ELECTRONIC CIRCUITRY

Kelly M. Lear

Person

Patents Grantslast 30 patents

System in package with flip chip die over multi-layer heatsink stan...

Reactance cancelling radio frequency circuit array

System in package with flip chip die over multi-layer heatsink stan...

Bulk acoustic wave resonator stacked onto an integrated passive device

Reactance cancelling radio frequency circuit array

Substrate with embedded active thermoelectric cooler

Electromagnetic shields with bonding wires for sub-modules

Electromagnetic shields for sub-modules

Electromagnetic shields for sub-modules

High isolation duplexer/quasi circulator with two quadrature couplers

High power and low loss acoustic filter

Patents Applicationslast 30 patents

SIP MODULE WITH STILTED INTERCONNECTS

MULTI-LAYER ELECTRICAL STRUCTURES

HIGH-REJECTION/HIGH-ISOLATION MODULE WITH EXTERNAL GROUND RE-REFERE...

ACOUSTIC FILTERS WITH IMPROVED RETURN LOSS

SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...

POWER AMPLIFIER WITH IMPROVED HARMONIC TERMINATION

REACTANCE CANCELLING RADIO FREQUENCY CIRCUIT ARRAY

REACTANCE CANCELLING RADIO FREQUENCY CIRCUIT ARRAY

SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...

ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES

BULK ACOUSTIC WAVE RESONATOR STACKED ONTO AN INTEGRATED PASSIVE DEVICE

ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES

ELECTROMAGNETIC SHIELDS FOR SUB-MODULES

HIGH ISOLATION DUPLEXER/QUASI CIRCULATOR WITH TWO QUADRATURE COUPLERS

ELECTROMAGNETIC SHIELDS FOR SUB-MODULES

SUBSTRATE WITH EMBEDDED ACTIVE THERMOELECTRIC COOLER

HIGH POWER AND LOW LOSS ACOUSTIC FILTER