Kelvin Aik Boo TAN

Person

Singapore, SG

People

Patents Applicationslast 30 patents

Information Patent Application
MOLDED COMPOUND PATTERNS ON PACKAGE BALL SIDE TO MITIGATE COPLANARI...
- Publication number 20240332216
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION
- Publication number 20240268132
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...
- Publication number 20240260281
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Wen Wei LUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE
- Publication number 20240203842
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Seng Kim YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES
- Publication number 20240194547
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- Ling PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
- Publication number 20240194630
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE
- Publication number 20240162207
- Publication date May 16, 2024
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
- Publication number 20240162206
- Publication date May 16, 2024
- Micron Technology, Inc.
- Seng Kim YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN
- Publication number 20240128182
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION
- Publication number 20240071886
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM FOR BONDING A FLIP CHIP DIE TO A SUBSTRATE
- Publication number 20240063201
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERPOSER FOR SEMICONDUCTOR DIES
- Publication number 20240063135
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Hong Wan NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING FOR STACKED MEMORY DIES
- Publication number 20240063168
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR HAVING ELECTRODES FORMED WITHIN A SUBSTRATE
- Publication number 20240021545
- Publication date Jan 18, 2024
- Micron Technology, Inc.
- Wen Wei LUM
- H01 - BASIC ELECTRIC ELEMENTS

Kelvin Aik Boo TAN

Person

Patents Applicationslast 30 patents

MOLDED COMPOUND PATTERNS ON PACKAGE BALL SIDE TO MITIGATE COPLANARI...

LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION

MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...

SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE

SUBSTRATES FOR SEMICONDUCTOR PACKAGES

BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE

PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE

LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE

DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN

MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION

NON-CONDUCTIVE FILM FOR BONDING A FLIP CHIP DIE TO A SUBSTRATE

FLEXIBLE INTERPOSER FOR SEMICONDUCTOR DIES

WIRE BONDING FOR STACKED MEMORY DIES

CAPACITOR HAVING ELECTRODES FORMED WITHIN A SUBSTRATE