Kelvin Tai

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid MEMS bump design to prevent in-process and in-use stiction
- Patent number 8,921,145
- Issue date Dec 30, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
HYBRID MEMS BUMP DESIGN TO PREVENT IN-PROCESS AND IN-USE STICTION
- Publication number 20140186986
- Publication date Jul 3, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY