Ken Fei LIM

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Taman Rasah Jaya, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for dicing die attach film on a semiconductor...
- Patent number 8,647,966
- Issue date Feb 11, 2014
- National Semiconductor Corporation
- Ken Fei Lim
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR DICING DIE ATTACH FILM ON A SEMICONDUCTOR...
- Publication number 20120313231
- Publication date Dec 13, 2012
- National Semiconductor Corporation
- Ken Fei LIM
- B28 - WORKING CEMENT, CLAY, OR STONE