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Ken-ichi Shimizu
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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Process for the production of high-density printed wiring board
Patent number
7,140,103
Issue date
Nov 28, 2006
Mitsubishi Gas Chemical Company, Inc.
Morio Gaku
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Process for the production of high-density printed wiring board
Publication number
20030049913
Publication date
Mar 13, 2003
Morio Gaku
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC