Ken IKEHATA

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Kashihara-shi, Nara, JP

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for attaching protective tape on semiconductor wafer
- Patent number 11,935,768
- Issue date Mar 19, 2024
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device and method for attaching protective tape to semiconductor wafer
- Patent number 11,469,120
- Issue date Oct 11, 2022
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ALIGNMENT DEVICE AND ALIGNMENT METHOD
- Publication number 20210249294
- Publication date Aug 12, 2021
- Disco-Hi-Tec Europe GmbH
- Karl Heinz PRIEWASSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR ATTACHING PROTECTIVE TAPE TO SEMICONDUCTOR WAFER
- Publication number 20210249286
- Publication date Aug 12, 2021
- Disco-Hi-Tec Europe GmbH
- Karl Heinz PRIEWASSER
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR ATTACHING PROTECTIVE TAPE ON SEMICONDUCTOR WAFER
- Publication number 20210249285
- Publication date Aug 12, 2021
- Disco-Hi-Tec Europe GmbH
- Karl Heinz PRIEWASSER
- B32 - LAYERED PRODUCTS