Ken IWAKURA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with bonding wires of reduced loop inductance
- Patent number 9,595,489
- Issue date Mar 14, 2017
- Longitude Semiconductor S.a.r.l.
- Mitsuaki Katagiri
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device stack with bonding layer and wire retaining me...
- Patent number 8,970,052
- Issue date Mar 3, 2015
- PS4 Luxco S.A.R.L.
- Yu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,853,822
- Issue date Oct 7, 2014
- PS4 Luxco S.A.R.L.
- Mitsuaki Katagiri
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Test method and interposer used therefor
- Patent number 8,680,881
- Issue date Mar 25, 2014
- Yutaka Uematsu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with bonding wires of reduced loop inductance
- Patent number 8,633,596
- Issue date Jan 21, 2014
- Mitsuaki Katagiri
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device stack with bonding layer and wire retaining me...
- Patent number 8,581,417
- Issue date Nov 12, 2013
- Elpida Memory, Inc.
- Yu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150022255
- Publication date Jan 22, 2015
- PS4 Luxco S.a.r.I.
- Mitsuaki KATAGIRI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BONDING WIRES OF REDUCED LOOP INDUCTANCE
- Publication number 20140103542
- Publication date Apr 17, 2014
- ELPIDA MEMORY, INC.
- Mitsuaki KATAGIRI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE STACK WITH BONDING LAYER AND WIRE RETAINING ME...
- Publication number 20140035166
- Publication date Feb 6, 2014
- Elpida Memory, Inc.
- Yu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130140674
- Publication date Jun 6, 2013
- Elpida Memory, Inc.
- Mitsuaki KATAGIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120200159
- Publication date Aug 9, 2012
- ELPIDA MEMORY, INC.
- Mitsuaki KATAGIRI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BONDING WIRES OF REDUCED LOOP INDUCTANCE
- Publication number 20120119387
- Publication date May 17, 2012
- ELPIDA MEMORY, INC.
- Mitsuaki KATAGIRI
- G11 - INFORMATION STORAGE
Information Patent Application
TEST METHOD AND INTERPOSER USED THEREFOR
- Publication number 20110234249
- Publication date Sep 29, 2011
- Elpida Memory, Inc.
- Yutaka UEMATSU
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor package substrate and semiconductor device having the...
- Publication number 20110084395
- Publication date Apr 14, 2011
- Elpida Memory, Inc.
- Hiromasa Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100193929
- Publication date Aug 5, 2010
- ELPIDA MEMORY, INC.
- Ken IWAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20100193933
- Publication date Aug 5, 2010
- ELPIDA MEMORY, INC.
- Yu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device or printed wiring board design method and desi...
- Publication number 20090327981
- Publication date Dec 31, 2009
- Elpida Memory, Inc.
- Satoshi Nakamura
- G06 - COMPUTING CALCULATING COUNTING

Ken IWAKURA

Person

Patents Grantslast 30 patents

Semiconductor package with bonding wires of reduced loop inductance

Semiconductor device stack with bonding layer and wire retaining me...

Semiconductor device

Test method and interposer used therefor

Semiconductor package with bonding wires of reduced loop inductance

Semiconductor device stack with bonding layer and wire retaining me...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH BONDING WIRES OF REDUCED LOOP INDUCTANCE

SEMICONDUCTOR DEVICE STACK WITH BONDING LAYER AND WIRE RETAINING ME...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH BONDING WIRES OF REDUCED LOOP INDUCTANCE

TEST METHOD AND INTERPOSER USED THEREFOR

Semiconductor package substrate and semiconductor device having the...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor device or printed wiring board design method and desi...