Ken Jian Ming Wang

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San Francisco, CA, US

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Patents Applicationslast 30 patents

Information Patent Application
Low cost lead frame package and method for forming same
- Publication number 20090057858
- Publication date Mar 5, 2009
- BROADCOM CORPORATION
- Ken Jian Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate warpage control and continuous electrical enhancement
- Publication number 20070004097
- Publication date Jan 4, 2007
- Cheemen Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit package having stacked integrated circuits and m...
- Publication number 20060267173
- Publication date Nov 30, 2006
- SanDisk Corporation
- Hem P. Takiar
- H01 - BASIC ELECTRIC ELEMENTS