Ken Liao

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for wafer backside cooling
- Patent number 10,867,816
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Hsiu Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming silicides with reduced tailing on silicon germanium and sil...
- Patent number 7,816,686
- Issue date Oct 19, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a strained channel in a semiconductor device
- Patent number 7,754,571
- Issue date Jul 13, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ken Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR WAFER BACKSIDE COOLING
- Publication number 20180166305
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hsiu CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming silicides with reduced tailing on silicon germanium and sil...
- Publication number 20080308842
- Publication date Dec 18, 2008
- Kuo-Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a strained channel in a semiconductor device
- Publication number 20080124875
- Publication date May 29, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ken Liao
- H01 - BASIC ELECTRIC ELEMENTS