Ken Nanaumi

Person

Chikusei, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Positive-type photosensitive resin composition, method for producti...
- Patent number 9,786,576
- Issue date Oct 10, 2017
- Hitachi Chemical Company, Ltd.
- Hiroshi Matsutani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Positive-type photosensitive resin composition, method for producin...
- Patent number 8,461,699
- Issue date Jun 11, 2013
- Hitachi Chemical Company, Ltd.
- Hiroshi Matsutani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Positive-type photosensitive resin composition, method for producin...
- Patent number 8,426,985
- Issue date Apr 23, 2013
- Hitachi Chemical Company, Ltd.
- Hiroshi Matsutani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Epoxy resin molding material for sealing and electronic component d...
- Patent number 8,084,130
- Issue date Dec 27, 2011
- Hitachi Chemical Co., Ltd.
- Mitsuyoshi Hamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyd...
- Patent number 7,538,150
- Issue date May 26, 2009
- Hitachi Chemical Company, Ltd.
- Kenichi Oohori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive film formed of a siloxane-modified polyamideimide resin co...
- Patent number 6,475,629
- Issue date Nov 5, 2002
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Siloxane-modified polyamideimide resin composition, adhesive film,...
- Patent number 6,252,010
- Issue date Jun 26, 2001
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding film for printed circuit boards
- Patent number 5,885,723
- Issue date Mar 23, 1999
- Hitachi Chemical Company, Ltd.
- Atsushi Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of preparing vegetable oil-modified phenolic resin and lamin...
- Patent number 5,380,789
- Issue date Jan 10, 1995
- Hitachi Chemical Company, Ltd.
- Ken Nanaumi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of producing a naphthol-modified phenolic resin of highly in...
- Patent number 5,206,333
- Issue date Apr 27, 1993
- Hitachi Chemical Company, Ltd.
- Haruaki Sue
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition for metal-clad laminates
- Patent number 5,066,691
- Issue date Nov 19, 1991
- Hitachi Chemical Co., Ltd.
- Toshihisa Kumakura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for producing phenolic resins
- Patent number 4,229,330
- Issue date Oct 21, 1980
- Hitachi Chemical Company, Ltd.
- Susumu Konii
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Grant
Process for producing internally plasticized phenolic resins
- Patent number 4,209,429
- Issue date Jun 24, 1980
- Hitachi Chemical Company, Ltd.
- Susumu Konii
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE

Patents Applicationslast 30 patents

Information Patent Application
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCIN...
- Publication number 20110254178
- Publication date Oct 20, 2011
- Hiroshi Matsutani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTI...
- Publication number 20110250396
- Publication date Oct 13, 2011
- Hiroshi Matsutani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POSTIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING...
- Publication number 20110204528
- Publication date Aug 25, 2011
- Hiroshi Matsutani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...
- Publication number 20090326100
- Publication date Dec 31, 2009
- Mitsuyoshi Hamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition, and prepreg, laminated board for w...
- Publication number 20060008632
- Publication date Jan 12, 2006
- Kenichi Oohori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition, and prepreg, laminate for circuit...
- Publication number 20040076805
- Publication date Apr 22, 2004
- Kenichi Oohori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Ken Nanaumi

Person

Patents Grantslast 30 patents

Positive-type photosensitive resin composition, method for producti...

Positive-type photosensitive resin composition, method for producin...

Positive-type photosensitive resin composition, method for producin...

Epoxy resin molding material for sealing and electronic component d...

Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyd...

Adhesive film formed of a siloxane-modified polyamideimide resin co...

Siloxane-modified polyamideimide resin composition, adhesive film,...

Bonding film for printed circuit boards

Method of preparing vegetable oil-modified phenolic resin and lamin...

Method of producing a naphthol-modified phenolic resin of highly in...

Adhesive composition for metal-clad laminates

Process for producing phenolic resins

Process for producing internally plasticized phenolic resins

Patents Applicationslast 30 patents

POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCIN...

POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTI...

POSTIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING...

EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...

Thermosetting resin composition, and prepreg, laminated board for w...

Thermosetting resin composition, and prepreg, laminate for circuit...