Ken Orui

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a device incorporated substrate and method...
- Patent number 8,146,243
- Issue date Apr 3, 2012
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate using temporary...
- Patent number 7,421,777
- Issue date Sep 9, 2008
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 7,420,127
- Issue date Sep 2, 2008
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate, and multilayer...
- Patent number 7,288,724
- Issue date Oct 30, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Junction structure and junction method for conductive projection
- Patent number 7,053,315
- Issue date May 30, 2006
- Sony Corporation
- Ken Orui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20070293038
- Publication date Dec 20, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20070102191
- Publication date May 10, 2007
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20050142852
- Publication date Jun 30, 2005
- Sony Corporation
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Junction structure and junction method for conductive projection
- Publication number 20050056445
- Publication date Mar 17, 2005
- Ken Orui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing multilayer wiring substrate, and multilayer...
- Publication number 20040003494
- Publication date Jan 8, 2004
- Hiroshi Asami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR