TREA

Ken Shimizu

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  • Nagoya, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor joining substrate utilizing a tape with adhesive and...
    • Patent number 6,982,484
    • Issue date Jan 3, 2006
    • Toray Industries, Inc.
    • Mikihiro Ogura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Epoxy resin composition
    • Patent number 5,919,844
    • Issue date Jul 6, 1999
    • Toray Industries, Inc.
    • Ken Shimizu
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Epoxy resin composition
    • Patent number 5,854,316
    • Issue date Dec 29, 1998
    • Toray Industries, Inc.
    • Ken Shimizu
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents