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Ken Tachibana

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20240363571
    • Publication date Oct 31, 2024
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    "Lead-Free Solder Ball"
    • Publication number 20190088611
    • Publication date Mar 21, 2019
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20190076966
    • Publication date Mar 14, 2019
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder Alloy, Solder Ball, Chip Solder, Solder Paste, and Solder Joint
    • Publication number 20190070696
    • Publication date Mar 7, 2019
    • SENJU METAL INDUSTRY CO., LTD.
    • Ken TACHIBANA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER ALLOY, SOLDER BALL, AND SOLDER JOINT
    • Publication number 20180361519
    • Publication date Dec 20, 2018
    • SENJU METAL INDUSTRY CO., LTD.
    • Ken TACHIBANA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20180005970
    • Publication date Jan 4, 2018
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY
    • Publication number 20180001426
    • Publication date Jan 4, 2018
    • SENJU METAL INDUSTRY CO., LTD.
    • Masayuki SUZUKI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Solder Alloy, Solder Ball, Chip Solder, Solder Paste and Solder Joint
    • Publication number 20170216975
    • Publication date Aug 3, 2017
    • SENJU METAL INDUSTRY CO., LTD.
    • Ken TACHIBANA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20160339543
    • Publication date Nov 24, 2016
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder, Lead-Free Solder Ball, Solder Joint Using the Lea...
    • Publication number 20160214212
    • Publication date Jul 28, 2016
    • SENJU METAL INDUSTRY CO., LTD.
    • Ken Tachibana
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20160074971
    • Publication date Mar 17, 2016
    • SENJU METAL INDUSTRY CO., LTD.
    • Ken Tachibana
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY AND IN-VEHICLE ELECTRONIC CIRCUIT
    • Publication number 20160056570
    • Publication date Feb 25, 2016
    • SENJU METAL INDUSTRY CO., LTD.
    • Shunsaku YOSHIKAWA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY
    • Publication number 20150328722
    • Publication date Nov 19, 2015
    • SENJU METAL INDUSTRY CO., LTD
    • Masayuki SUZUKI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    SOLDERING METHOD USING A LOW-TEMPERATURE SOLDER PASTE
    • Publication number 20150282332
    • Publication date Oct 1, 2015
    • SENJU METAL INDUSTRY CO., LTD.,
    • Masato Shimamura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20150221606
    • Publication date Aug 6, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Yoshie Yamanaka
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20150037087
    • Publication date Feb 5, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Ken Tachibana
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder Alloy
    • Publication number 20150037088
    • Publication date Feb 5, 2015
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder Ball
    • Publication number 20140061287
    • Publication date Mar 6, 2014
    • SENJU METAL INDUSTRY CO., LTD.
    • Tsukasa Ohnishi
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Control apparatus of internal combustion engine
    • Publication number 20070017482
    • Publication date Jan 25, 2007
    • Mitsubishi Denki Kabushiki Kaisha
    • Shogo Nakashima
    • F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
  • Information Patent Application

    Start control apparatus of internal combustion engine
    • Publication number 20040194749
    • Publication date Oct 7, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Shiro Yonezawa
    • F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
  • Information Patent Application

    Apparatus for rewriting a memory in a vehicle mounted ECU through c...
    • Publication number 20040002793
    • Publication date Jan 1, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Ken Tachibana
    • G06 - COMPUTING CALCULATING COUNTING