Ken Wang

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Milpitas, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Hermetic solution for thermal and optical sensor-in-package
- Patent number 9,564,569
- Issue date Feb 7, 2017
- Maxim Integrated Products, Inc.
- Ken Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon shield for package stress sensitive devices
- Patent number 9,355,968
- Issue date May 31, 2016
- Maxim Integrated Products, Inc.
- Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked LED for optical sensor devices
- Patent number 9,136,258
- Issue date Sep 15, 2015
- Maxim Integrated Products, Inc.
- Ken Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LID ASSEMBLY FOR THERMOPILE TEMPERATURE SENSING DEVICE IN THERMAL G...
- Publication number 20150380627
- Publication date Dec 31, 2015
- QUALCOMM TECHNOLOGIES, INC.
- Arvin Emadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SHIELD FOR PACKAGE STRESS SENSITIVE DEVICES
- Publication number 20150364431
- Publication date Dec 17, 2015
- Maxim Integrated Products, Inc.
- Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS