Ken-Yuan Chang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical vapor deposition for uniform tungsten growth
- Patent number 12,252,783
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pin-Wen Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3DIC with gap-fill structures and the method of manufacturing the same
- Patent number 12,249,566
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact metallization process
- Patent number 12,191,199
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Pei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact conductive feature formation and structure
- Patent number 12,148,659
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ken-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for liner-free conductive structures
- Patent number 12,057,397
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,020,981
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductive feature including cleaning step
- Patent number 11,955,329
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures including a fin structure and a metal cap
- Patent number 11,929,314
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 11,817,384
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 11,798,843
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact formation methods and devices
- Patent number 11,742,240
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact conductive feature formation and structure
- Patent number 11,676,859
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ken-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductive feature including cleaning step
- Patent number 11,670,499
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures
- Patent number 11,594,609
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for liner-free conductive structures
- Patent number 11,521,929
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact formation methods and devices
- Patent number 11,257,712
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 11,217,524
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor contact structure
- Patent number 11,195,791
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact conductive feature formation and structure
- Patent number 11,062,941
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ken-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 10,971,396
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact metallization process
- Patent number 10,964,590
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Pei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact conductive feature formation and structure
- Patent number 10,580,693
- Issue date Mar 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ken-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and the method of forming the same
- Patent number 10,504,834
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing copper layer
- Patent number 10,504,832
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ken-Yu Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive feature formation and structure
- Patent number 10,361,120
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with TiN adhesion layer for forming a contact...
- Patent number 10,332,789
- Issue date Jun 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Pei Chou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming hybrid diffusion barrier layer and semiconductor...
- Patent number 9,812,397
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Shiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for line stress reduction through dummy shoulder structures
- Patent number 9,437,485
- Issue date Sep 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Cheng Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming a copper layer using physical vapor deposition
- Patent number 9,240,378
- Issue date Jan 19, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ken-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming hybrid diffusion barrier layer and semiconductor...
- Patent number 8,962,473
- Issue date Feb 24, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Shiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070010
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070007
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT METALLIZATION PROCESS
- Publication number 20240395611
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Pei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping Layer For Liner-Free Conductive Structures
- Publication number 20240355741
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20240297074
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Conductive Feature Including Cleaning Step
- Publication number 20240213016
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME
- Publication number 20240178102
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Ti LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240170381
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND ME...
- Publication number 20230402366
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES
- Publication number 20230386913
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20230369109
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONDUCTIVE LINERS OVER SILICIDE STRUCTURE...
- Publication number 20230299168
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Conductive Feature Including Cleaning Step
- Publication number 20230268173
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Conductive Feature Formation and Structure
- Publication number 20230268228
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ken-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230230916
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING LAYER FOR LINER-FREE CONDUCTIVE STRUCTURES
- Publication number 20230095976
- Publication date Mar 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL VAPOR DEPOSITION FOR UNIFORM TUNGSTEN GROWTH
- Publication number 20230038744
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Wen CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERFACE TOOL AND METHODS OF OPERATION
- Publication number 20230029508
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Syuan TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER-FREE CONDUCTIVE STRUCTURES
- Publication number 20220367662
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing, Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Thereof
- Publication number 20220301858
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20220293503
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Hsien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES
- Publication number 20220189825
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20220130755
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUEN-SHIN LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210391252
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUEN-SHIN LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER-FREE CONDUCTIVE STRUCTURES
- Publication number 20210376103
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing, Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Contact Formation Methods and Devices
- Publication number 20210358804
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Conductive Feature Formation and Structure
- Publication number 20210343590
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ken-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING LAYER FOR LINER-FREE CONDUCTIVE STRUCTURES
- Publication number 20210335720
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Metallization Process
- Publication number 20210280462
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Pei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20210225701
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS

Ken-Yuan Chang

Person

Patents Grantslast 30 patents

Chemical vapor deposition for uniform tungsten growth

3DIC with gap-fill structures and the method of manufacturing the same

Contact metallization process

Contact conductive feature formation and structure

Capping layer for liner-free conductive structures

Conductive feature formation and structure

Method of forming conductive feature including cleaning step

Interconnect structures including a fin structure and a metal cap

Interconnect structure and manufacturing method for the same

Conductive feature formation and structure

Source/drain contact formation methods and devices

Contact conductive feature formation and structure

Method of forming conductive feature including cleaning step

Liner-free conductive structures

Capping layer for liner-free conductive structures

Source/drain contact formation methods and devices

Interconnect structure and manufacturing method for the same

Method for forming semiconductor contact structure

Contact conductive feature formation and structure

Conductive feature formation and structure

Contact metallization process

Contact conductive feature formation and structure

Contact structure and the method of forming the same

Method for manufacturing copper layer

Conductive feature formation and structure

Semiconductor device with TiN adhesion layer for forming a contact...

Method of forming hybrid diffusion barrier layer and semiconductor...

Method for line stress reduction through dummy shoulder structures

Method of forming a copper layer using physical vapor deposition

Method of forming hybrid diffusion barrier layer and semiconductor...

Patents Applicationslast 30 patents

3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME

3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME

CONTACT METALLIZATION PROCESS

Capping Layer For Liner-Free Conductive Structures

Conductive Feature Formation and Structure

Method of Forming Conductive Feature Including Cleaning Step

PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND ME...

SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES

Conductive Feature Formation and Structure

SEMICONDUCTOR DEVICE WITH CONDUCTIVE LINERS OVER SILICIDE STRUCTURE...

Method of Forming Conductive Feature Including Cleaning Step

Contact Conductive Feature Formation and Structure

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CAPPING LAYER FOR LINER-FREE CONDUCTIVE STRUCTURES

CHEMICAL VAPOR DEPOSITION FOR UNIFORM TUNGSTEN GROWTH

INTERFACE TOOL AND METHODS OF OPERATION

LINER-FREE CONDUCTIVE STRUCTURES

Semiconductor Device and Method of Forming Thereof

INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF

SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

LINER-FREE CONDUCTIVE STRUCTURES

Source/Drain Contact Formation Methods and Devices

Contact Conductive Feature Formation and Structure

CAPPING LAYER FOR LINER-FREE CONDUCTIVE STRUCTURES

Contact Metallization Process

Conductive Feature Formation and Structure