Ken YUKAWA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive coating material and production method for shielded pack...
- Patent number 11,414,554
- Issue date Aug 16, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive coating material and production method for shielded pack...
- Patent number 11,370,926
- Issue date Jun 28, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Heat dissipation material adhering composition, heat dissipation ma...
- Patent number 11,236,227
- Issue date Feb 1, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Heat dissipation substrate, heat dissipation circuit structure body...
- Patent number 10,893,603
- Issue date Jan 12, 2021
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board
- Patent number 9,420,706
- Issue date Aug 16, 2016
- Tatsuta Electric Wire & Cable Co., Ltd.
- Norihiro Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer printed wiring board
- Patent number 8,756,805
- Issue date Jun 24, 2014
- Tatsuta Electric Wire & Cable Co., Ltd.
- Norihiro Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20200299523
- Publication date Sep 24, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki UMEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20200299524
- Publication date Sep 24, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki UMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY...
- Publication number 20200084875
- Publication date Mar 12, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20190292381
- Publication date Sep 26, 2019
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hajime Nakazono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT DISSIPATION MATERIAL ADHERING COMPOSITION, HEAT DISSIPATION MA...
- Publication number 20180298185
- Publication date Oct 18, 2018
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN-CLAD COPPER FOIL, AND PRINTED WIRING BOARD
- Publication number 20180222152
- Publication date Aug 9, 2018
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20140138126
- Publication date May 22, 2014
- Tatsuta Electric Wire & Cable Co., Ltd.
- Norihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20120037409
- Publication date Feb 16, 2012
- Norihiro Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Conductive coating material and production method for shielded pack...

Conductive coating material and production method for shielded pack...

Heat dissipation material adhering composition, heat dissipation ma...

Heat dissipation substrate, heat dissipation circuit structure body...

Multilayer wiring board

Method of manufacturing multilayer printed wiring board

Patents Applicationslast 30 patents

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY...

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

HEAT DISSIPATION MATERIAL ADHERING COMPOSITION, HEAT DISSIPATION MA...

RESIN-CLAD COPPER FOIL, AND PRINTED WIRING BOARD

METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...

METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...