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Ken Zhonghua Wu
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Fremont, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Low cost and high performance flip chip package
Patent number
8,957,516
Issue date
Feb 17, 2015
Broadcom Corporation
Mengzhi Pang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
LOW COST AND HIGH PERFORMANCE FLIP CHIP PACKAGE
Publication number
20140217573
Publication date
Aug 7, 2014
BROADCOM CORPORATION
Mengzhi PANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low Cost and High Performance Flip Chip Package
Publication number
20130187284
Publication date
Jul 25, 2013
BROADCOM CORPORATION
Mengzhi Pang
H01 - BASIC ELECTRIC ELEMENTS