Kendall D. Phillips

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Driftwood, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid lead frame for semiconductor die package with improved creep...
- Patent number 10,734,311
- Issue date Aug 4, 2020
- NXP USA, INC.
- Mariano Layson Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having pads and input/output (I/O) cells
- Patent number 7,808,117
- Issue date Oct 5, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Nhat D. Vo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEP...
- Publication number 20200203262
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Mariano Layson CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
- Publication number 20070267755
- Publication date Nov 22, 2007
- Nhat D. Vo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
- Publication number 20070267748
- Publication date Nov 22, 2007
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS