Keng Yew Song

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method for measuring the heights of wire interconnections
- Patent number 11,543,362
- Issue date Jan 3, 2023
- ASMPT SINGAPORE PTE. LTD.
- Keng Yew Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated particle removal system having angular adjustability
- Patent number 11,400,495
- Issue date Aug 2, 2022
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B08 - CLEANING
Information Patent Grant
Multiple actuator wire bonding apparatus
- Patent number 11,289,446
- Issue date Mar 29, 2022
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus threading system
- Patent number 11,239,197
- Issue date Feb 1, 2022
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for processing a semiconductor device
- Patent number 11,227,779
- Issue date Jan 18, 2022
- ASM Technology Singapore Pte. Ltd.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving system having reduced vibration transmission
- Patent number 11,205,937
- Issue date Dec 21, 2021
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus with replaceable bonding tool
- Patent number 11,205,634
- Issue date Dec 21, 2021
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of bonding wire vertical interconnects
- Patent number 11,145,620
- Issue date Oct 12, 2021
- ASM Technology Singapore Pte. Ltd.
- Mow Huat Goh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated particle removal system
- Patent number 11,017,996
- Issue date May 25, 2021
- ASM Technology Singapore Pte. Ltd.
- Gang Shu
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for measuring a free air ball size during wire...
- Patent number 10,163,845
- Issue date Dec 25, 2018
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for pull testing of wire bonds
- Patent number 9,889,521
- Issue date Feb 13, 2018
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming three-dimensional wire loops and wire loops forme...
- Patent number 9,881,891
- Issue date Jan 30, 2018
- ASM Technology Singapore Pte. Ltd.
- Jeffrey Grijaldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus comprising an oscillator mechanism
- Patent number 9,640,512
- Issue date May 2, 2017
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonder and method of calibrating a wire bonder
- Patent number 9,620,477
- Issue date Apr 11, 2017
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic wire tail adjustment system for wire bonders
- Patent number 9,502,374
- Issue date Nov 22, 2016
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding machine incorporating dual-track transfer mechanism
- Patent number 8,707,550
- Issue date Apr 29, 2014
- ASM Technology Singapore Pte. Ltd.
- Keng Yew James Song
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Automatic wire feeding method for wire bonders
- Patent number 8,459,530
- Issue date Jun 11, 2013
- ASM Technology Singapore Pte. Ltd.
- Yue Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for detecting the oscillation amplitude of an oscillating...
- Patent number 6,827,247
- Issue date Dec 7, 2004
- ASM Technology Singapore PTE LTD
- Liming Fan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple-head wire-bonding system
- Patent number 6,749,100
- Issue date Jun 15, 2004
- ASM Technology Singapore PTE LTD
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding system
- Patent number 6,572,001
- Issue date Jun 3, 2003
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detection of wire bonding failures
- Patent number 6,568,581
- Issue date May 27, 2003
- ASM Technology Singapore Pte. Ltd.
- Michael Armin Boller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE PATH PLATE HAVING ENHANCED DURABILITY FOR WIRE BONDING
- Publication number 20240347500
- Publication date Oct 17, 2024
- ASMPT Singapore Pte. Ltd.
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE ASSEMBLY
- Publication number 20240259661
- Publication date Aug 1, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CONDUCTING SHEAR TESTS ON INTERCONNECT BONDS
- Publication number 20230341305
- Publication date Oct 26, 2023
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR CALIBRATING A SHEAR TEST TOOL
- Publication number 20230137302
- Publication date May 4, 2023
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- G01 - MEASURING TESTING
Information Patent Application
AUTOMATED PARTICLE REMOVAL SYSTEM HAVING ANGULAR ADJUSTABILITY
- Publication number 20220073286
- Publication date Mar 10, 2022
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
WIRE BONDING APPARATUS THREADING SYSTEM
- Publication number 20210159205
- Publication date May 27, 2021
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MEASURING THE HEIGHTS OF WIRE INTERCONNECTIONS
- Publication number 20200348243
- Publication date Nov 5, 2020
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- G01 - MEASURING TESTING
Information Patent Application
AUTOMATED PARTICLE REMOVAL SYSTEM
- Publication number 20200321211
- Publication date Oct 8, 2020
- ASM Technology Singapore Pte Ltd
- Gang SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF BONDING WIRE VERTICAL INTERCONNECTS
- Publication number 20200286855
- Publication date Sep 10, 2020
- ASM Technology Singapore Pte Ltd
- Mow Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SYSTEM HAVING REDUCED VIBRATION TRANSMISSION
- Publication number 20200028407
- Publication date Jan 23, 2020
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS WITH REPLACEABLE BONDING TOOL
- Publication number 20200020661
- Publication date Jan 16, 2020
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE ACTUATOR WIRE BONDING APPARATUS
- Publication number 20190304947
- Publication date Oct 3, 2019
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
- Publication number 20190080939
- Publication date Mar 14, 2019
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PULL TESTING OF WIRE BONDS
- Publication number 20160153880
- Publication date Jun 2, 2016
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS COMPRISING AN OSCILLATOR MECHANISM
- Publication number 20160023298
- Publication date Jan 28, 2016
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MEASURING A FREE AIR BALL SIZE DURING WIRE...
- Publication number 20150008251
- Publication date Jan 8, 2015
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDER AND METHOD OF CALIBRATING A WIRE BONDER
- Publication number 20140209663
- Publication date Jul 31, 2014
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC WIRE TAIL ADJUSTMENT SYSTEM FOR WIRE BONDERS
- Publication number 20130098877
- Publication date Apr 25, 2013
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multiple-head wire-bonding system
- Publication number 20030098340
- Publication date May 29, 2003
- ASM Technology Singapore Pte Ltd
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding system
- Publication number 20030006266
- Publication date Jan 9, 2003
- ASM Technology Singapore Pte Ltd
- Yam M. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Detection of wire bonding failures
- Publication number 20020130158
- Publication date Sep 19, 2002
- Michael Armin Boller
- H01 - BASIC ELECTRIC ELEMENTS

Keng Yew Song

Person

Patents Grantslast 30 patents

Method for measuring the heights of wire interconnections

Automated particle removal system having angular adjustability

Multiple actuator wire bonding apparatus

Wire bonding apparatus threading system

Apparatus and method for processing a semiconductor device

Driving system having reduced vibration transmission

Bonding apparatus with replaceable bonding tool

Formation of bonding wire vertical interconnects

Automated particle removal system

Method and apparatus for measuring a free air ball size during wire...

Method and system for pull testing of wire bonds

Method of forming three-dimensional wire loops and wire loops forme...

Wire bonding apparatus comprising an oscillator mechanism

Wire bonder and method of calibrating a wire bonder

Automatic wire tail adjustment system for wire bonders

Bonding machine incorporating dual-track transfer mechanism

Automatic wire feeding method for wire bonders

Apparatus for detecting the oscillation amplitude of an oscillating...

Multiple-head wire-bonding system

Bonding system

Detection of wire bonding failures

Patents Applicationslast 30 patents

WIRE PATH PLATE HAVING ENHANCED DURABILITY FOR WIRE BONDING

CAMERA MODULE ASSEMBLY

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

METHOD AND APPARATUS FOR CONDUCTING SHEAR TESTS ON INTERCONNECT BONDS

APPARATUS AND METHOD FOR CALIBRATING A SHEAR TEST TOOL

AUTOMATED PARTICLE REMOVAL SYSTEM HAVING ANGULAR ADJUSTABILITY

WIRE BONDING APPARATUS THREADING SYSTEM

METHOD FOR MEASURING THE HEIGHTS OF WIRE INTERCONNECTIONS

AUTOMATED PARTICLE REMOVAL SYSTEM

FORMATION OF BONDING WIRE VERTICAL INTERCONNECTS

DRIVING SYSTEM HAVING REDUCED VIBRATION TRANSMISSION

BONDING APPARATUS WITH REPLACEABLE BONDING TOOL

MULTIPLE ACTUATOR WIRE BONDING APPARATUS

APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE

METHOD AND SYSTEM FOR PULL TESTING OF WIRE BONDS

WIRE BONDING APPARATUS COMPRISING AN OSCILLATOR MECHANISM

METHOD AND APPARATUS FOR MEASURING A FREE AIR BALL SIZE DURING WIRE...

WIRE BONDER AND METHOD OF CALIBRATING A WIRE BONDER

AUTOMATIC WIRE TAIL ADJUSTMENT SYSTEM FOR WIRE BONDERS

Multiple-head wire-bonding system

Bonding system

Detection of wire bonding failures