Keng-Ying LIAO

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Flash memory device with three dimensional half flash structure and...
- Patent number 12,218,253
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory device including a buried floating gate and a buried e...
- Patent number 12,199,159
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and methods of forming the same
- Patent number 12,191,338
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Keng-Ying Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer treatment system and method of treating wafer
- Patent number 12,183,550
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI chip with backside alignment mark
- Patent number 12,094,997
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polysilicon removal in word line contact region of memory devices
- Patent number 12,041,771
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Jou Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 11,901,390
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two dimensional structure to control flash operation and methods fo...
- Patent number 11,903,193
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Chung Jen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory device with three-dimensional half flash structure and...
- Patent number 11,888,074
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 11,804,529
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two dimensional structure to control flash operation and methods fo...
- Patent number 11,792,981
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Chung Jen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory device including a buried floating gate and a buried e...
- Patent number 11,728,399
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory device with three-dimensional half flash structure and...
- Patent number 11,658,248
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and methods of forming the same
- Patent number 11,652,127
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Keng-Ying Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor grid and method of manufacturing same
- Patent number 11,652,133
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Co.
- H. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor grid and method of fabrication of same
- Patent number 11,532,658
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polysilicon removal in word line contact region of memory devices
- Patent number 11,527,543
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Jou Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for forming image sensor devices
- Patent number 11,502,123
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Keng-Ying Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI chip with backside alignment mark
- Patent number 11,430,909
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 11,282,931
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory device including a buried floating gate and a buried e...
- Patent number 11,183,572
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS sensors and methods of forming the same
- Patent number 11,177,308
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with pad structure
- Patent number 11,164,903
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huai-jen Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor grid and method of manufacturing same
- Patent number 11,069,740
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- H. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 10,879,289
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 10,811,423
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Keng-Ying Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure
- Patent number 10,665,466
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Keng-Ying Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 10,658,269
- Issue date May 19, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing CMOS image sensor
- Patent number 10,522,585
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Fang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS sensors and methods of forming the same
- Patent number 10,283,548
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WET TOOL KIT FOR FORMING SEMICONDUCTOR STRUCTURE AND CMOS IMAGE SEN...
- Publication number 20240404832
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Chenchia Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER
- Publication number 20240387146
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI CHIP WITH BACKSIDE ALIGNMENT MARK
- Publication number 20240363791
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSING ELEMENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240213395
- Publication date Jun 27, 2024
- Taiwan-Asia Semiconductor Corporation
- Yang-Ting LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flash Memory Device with Three-Dimensional Half Structure and Metho...
- Publication number 20240136444
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136383
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME
- Publication number 20240047496
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polysilicon Removal In Word Line Contact Region Of Memory Devices
- Publication number 20230389309
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Jou WU
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369430
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY DEVICE INCLUDING A BURIED FLOATING GATE AND A BURIED E...
- Publication number 20230343844
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20230253433
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Keng-Ying Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flash Memory Device with Three Dimensional Half Flash Structure and...
- Publication number 20230253508
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME
- Publication number 20230120006
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220406608
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-JEN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYSILICON REMOVAL IN WORD LINE CONTACT REGION OF MEMORY DEVICES
- Publication number 20220367495
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Jou WU
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FORMING IMAGE SENSOR DEVICES
- Publication number 20220367559
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Keng-Ying Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Chip with Backside Alignment Mark
- Publication number 20220359781
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20220359606
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Keng-Ying Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY DEVICE WITH THREE-DIMENSIONAL HALF FLASH STRUCTURE AND...
- Publication number 20220359760
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME
- Publication number 20220359598
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO DIMENSIONAL STRUCTURE TO CONTROL FLASH OPERATION AND METHODS FO...
- Publication number 20220352192
- Publication date Nov 3, 2022
- TAIWAN SEMICONDUCTOR MANFACTURING COMPANY LIMITED
- Chi-Chung JEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY DEVICE WITH THREE-DIMENSIONAL HALF FLASH STRUCTURE AND...
- Publication number 20220285558
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER
- Publication number 20220277933
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216315
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077217
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO DIMENSIONAL STRUCTURE TO CONTROL FLASH OPERATION AND METHODS FO...
- Publication number 20220059556
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Chung JEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY DEVICE INCLUDING A BURIED FLOATING GATE AND A BURIED E...
- Publication number 20220028993
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYSILICON REMOVAL IN WORD LINE CONTACT REGION OF MEMORY DEVICES
- Publication number 20210408023
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Y.J. WU
- G11 - INFORMATION STORAGE
Information Patent Application
IMAGE SENSOR GRID AND METHOD OF MANUFACTURING SAME
- Publication number 20210351225
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co.
- H. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY DEVICE INCLUDING A BURIED FLOATING GATE AND A BURIED E...
- Publication number 20210328034
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS

Keng-Ying LIAO

Person

Patents Grantslast 30 patents

Flash memory device with three dimensional half flash structure and...

Flash memory device including a buried floating gate and a buried e...

Image sensor device and methods of forming the same

Wafer treatment system and method of treating wafer

BSI chip with backside alignment mark

Polysilicon removal in word line contact region of memory devices

Semiconductor device

Two dimensional structure to control flash operation and methods fo...

Flash memory device with three-dimensional half flash structure and...

Memory device and manufacturing method thereof

Two dimensional structure to control flash operation and methods fo...

Flash memory device including a buried floating gate and a buried e...

Flash memory device with three-dimensional half flash structure and...

Image sensor device and methods of forming the same

Image sensor grid and method of manufacturing same

Image sensor grid and method of fabrication of same

Polysilicon removal in word line contact region of memory devices

Methods for forming image sensor devices

BSI chip with backside alignment mark

Memory device and manufacturing method thereof

Flash memory device including a buried floating gate and a buried e...

CMOS sensors and methods of forming the same

Image sensor with pad structure

Image sensor grid and method of manufacturing same

Method for forming a semiconductor device

Method of fabricating semiconductor structure

Method for forming semiconductor device structure

Semiconductor structure and manufacturing method of the same

Method for manufacturing CMOS image sensor

CMOS sensors and methods of forming the same

Patents Applicationslast 30 patents

WET TOOL KIT FOR FORMING SEMICONDUCTOR STRUCTURE AND CMOS IMAGE SEN...

WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER

BSI CHIP WITH BACKSIDE ALIGNMENT MARK

LIGHT SENSING ELEMENT AND MANUFACTURING METHOD THEREOF

Flash Memory Device with Three-Dimensional Half Structure and Metho...

SEMICONDUCTOR DEVICE

IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME

Polysilicon Removal In Word Line Contact Region Of Memory Devices

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

FLASH MEMORY DEVICE INCLUDING A BURIED FLOATING GATE AND A BURIED E...

IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

Flash Memory Device with Three Dimensional Half Flash Structure and...

IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

POLYSILICON REMOVAL IN WORD LINE CONTACT REGION OF MEMORY DEVICES

METHOD FOR FORMING IMAGE SENSOR DEVICES

BSI Chip with Backside Alignment Mark

IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

FLASH MEMORY DEVICE WITH THREE-DIMENSIONAL HALF FLASH STRUCTURE AND...

IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME

TWO DIMENSIONAL STRUCTURE TO CONTROL FLASH OPERATION AND METHODS FO...

FLASH MEMORY DEVICE WITH THREE-DIMENSIONAL HALF FLASH STRUCTURE AND...

WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

TWO DIMENSIONAL STRUCTURE TO CONTROL FLASH OPERATION AND METHODS FO...

FLASH MEMORY DEVICE INCLUDING A BURIED FLOATING GATE AND A BURIED E...

POLYSILICON REMOVAL IN WORD LINE CONTACT REGION OF MEMORY DEVICES

IMAGE SENSOR GRID AND METHOD OF MANUFACTURING SAME

FLASH MEMORY DEVICE INCLUDING A BURIED FLOATING GATE AND A BURIED E...