Kengo Kaminaga

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sputtering target product and method for producing recycled sputter...
- Patent number 12,054,822
- Issue date Aug 6, 2024
- JX Advanced Metals Corporation
- Kengo Kaminaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid crystal polymer copper-clad laminate and copper foil used fo...
- Patent number 9,060,431
- Issue date Jun 16, 2015
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rolled copper foil or electrolytic copper foil for electronic circu...
- Patent number 8,668,994
- Issue date Mar 11, 2014
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Rolled copper foil or electrolytic copper foil for electronic circu...
- Patent number 8,580,390
- Issue date Nov 12, 2013
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of forming electronic circuit
- Patent number 8,357,307
- Issue date Jan 22, 2013
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil for printed circuit board and copper clad laminate for...
- Patent number 8,142,905
- Issue date Mar 27, 2012
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Sputtering Target And Method For Manufacturing The Same
- Publication number 20240417845
- Publication date Dec 19, 2024
- Yusuke Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering Target Product And Method For Producing Recycled Sputter...
- Publication number 20230132362
- Publication date Apr 27, 2023
- JX Nippon Mining & Metals Corporation
- Kengo Kaminaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering Target Product And Method For Producing Recycled Sputter...
- Publication number 20220098723
- Publication date Mar 31, 2022
- JX Nippon Mining & Metals Corporation
- Kengo Kaminaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Co Anode, And Co Electroplating Method Using Co Anode
- Publication number 20210010149
- Publication date Jan 14, 2021
- JX Nippon Mining & Metals Corporation
- Shuhei Murata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Tungsten Sintered Compact Sputtering Target and Tungsten Film Forme...
- Publication number 20180261438
- Publication date Sep 13, 2018
- JX NIPPON MINING & METALS CORPORATION
- Kengo Kaminaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Tungsten Sintered Compact Sputtering Target and Tungsten Film Forme...
- Publication number 20150303040
- Publication date Oct 22, 2015
- JX NIPPON MINING & METALS CORPORATION
- Kengo Kaminaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used Fo...
- Publication number 20140093743
- Publication date Apr 3, 2014
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20130270218
- Publication date Oct 17, 2013
- Keisuke Yamanishi
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER FOIL FOR NEGATIVE ELECTRODE CURRENT COLLECTOR OF SECONDARY B...
- Publication number 20130011734
- Publication date Jan 10, 2013
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC CIRCUIT, METHOD FOR FORMING SAME, AND COPPER CLAD LAMINA...
- Publication number 20120318568
- Publication date Dec 20, 2012
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil for Printed Circuit Board and Copper Clad Laminate for...
- Publication number 20120148862
- Publication date Jun 14, 2012
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil and Method for Producing Same
- Publication number 20120135266
- Publication date May 31, 2012
- JX NIPPON MINING & METALS CORPORATION
- Kengo Kaminaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110300401
- Publication date Dec 8, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110297641
- Publication date Dec 8, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110293960
- Publication date Dec 1, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Forming Electronic Circuit
- Publication number 20110284496
- Publication date Nov 24, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110259848
- Publication date Oct 27, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil for Printed Circuit Board and Copper Clad Laminate for...
- Publication number 20100261033
- Publication date Oct 14, 2010
- Nippon Mining & Metals Co., Ltd.
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kengo Kaminaga

Person

Patents Grantslast 30 patents

Sputtering target product and method for producing recycled sputter...

Liquid crystal polymer copper-clad laminate and copper foil used fo...

Rolled copper foil or electrolytic copper foil for electronic circu...

Rolled copper foil or electrolytic copper foil for electronic circu...

Method of forming electronic circuit

Copper foil for printed circuit board and copper clad laminate for...

Patents Applicationslast 30 patents

Sputtering Target And Method For Manufacturing The Same

Sputtering Target Product And Method For Producing Recycled Sputter...

Sputtering Target Product And Method For Producing Recycled Sputter...

Co Anode, And Co Electroplating Method Using Co Anode

Tungsten Sintered Compact Sputtering Target and Tungsten Film Forme...

Tungsten Sintered Compact Sputtering Target and Tungsten Film Forme...

Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used Fo...

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

COPPER FOIL FOR NEGATIVE ELECTRODE CURRENT COLLECTOR OF SECONDARY B...

ELECTRONIC CIRCUIT, METHOD FOR FORMING SAME, AND COPPER CLAD LAMINA...

Copper Foil for Printed Circuit Board and Copper Clad Laminate for...

Copper Foil and Method for Producing Same

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Method of Forming Electronic Circuit

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Copper Foil for Printed Circuit Board and Copper Clad Laminate for...