Kengo Oka

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Nukata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method for manufacturing same
- Patent number 9,941,182
- Issue date Apr 10, 2018
- Denso Corporation
- Norihisa Imaizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold package and manufacturing method thereof
- Patent number 9,646,907
- Issue date May 9, 2017
- Denso Corporation
- Kengo Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-mold type mold package
- Patent number 9,601,442
- Issue date Mar 21, 2017
- Denso Corporation
- Kengo Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste composition including conductive metallic powder
- Patent number 6,174,462
- Issue date Jan 16, 2001
- Denso Corporation
- Kengo Oka
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Thick film circuit board and method of forming wire bonding electro...
- Patent number 6,020,048
- Issue date Feb 1, 2000
- Denso Corporation
- Kengo Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 5,483,217
- Issue date Jan 9, 1996
- Nippondenso Co., Ltd.
- Takashi Nagasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220223544
- Publication date Jul 14, 2022
- DENSO CORPORATION
- Daisuke FUKUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD PACKAGE
- Publication number 20160293555
- Publication date Oct 6, 2016
- Denso Corporation
- Kengo OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160133539
- Publication date May 12, 2016
- Denso Corporation
- Kengo OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20160104653
- Publication date Apr 14, 2016
- Norihisa IMAIZUMI
- H01 - BASIC ELECTRIC ELEMENTS