Kenichi FUJII

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Aizuwakamatsu-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication method for semiconductor device having laminated electr...
- Patent number 8,278,171
- Issue date Oct 2, 2012
- Spansion LLC
- Kenichi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having laminated electronic conductor on bit line
- Patent number 7,943,982
- Issue date May 17, 2011
- Spansion LLC
- Kenichi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,847,340
- Issue date Dec 7, 2010
- Spansion LLC
- Kenichi Fujii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING LAMINATED ELECTRONIC CONDUCTOR ON BIT LINE
- Publication number 20110183510
- Publication date Jul 28, 2011
- Kenichi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080191321
- Publication date Aug 14, 2008
- SPANSION LLC
- Kenichi FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication method therefor
- Publication number 20060278936
- Publication date Dec 14, 2006
- Kenichi Fujii
- H01 - BASIC ELECTRIC ELEMENTS