Kenichi Hinuma

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Kizugawa-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SWITCH AND METHOD FOR MANUFACTURING THE SAME, AND RELAY
- Publication number 20140034465
- Publication date Feb 6, 2014
- Omron Corporation
- Takahiro Masuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SWITCH AND METHOD FOR MANUFACTURING THE SAME, AND RELAY
- Publication number 20110209970
- Publication date Sep 1, 2011
- Omron Corporation
- Takahiro Masuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY