Kenichi Hirano

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Sendai, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire
- Patent number 4,752,442
- Issue date Jun 21, 1988
- Shoei Chemical Inc.
- Eiichi Asada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...