Kenichi HOTEHAMA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Negative electrode material including composite particles, and meth...
- Patent number 10,644,310
- Issue date May 5, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positive electrode plates for nonaqueous electrolyte secondary batt...
- Patent number 10,483,594
- Issue date Nov 19, 2019
- Panasonic Corporation
- Hiroshi Kawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative electrode material including composite particles, and meth...
- Patent number 10,424,785
- Issue date Sep 24, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Katou
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Flexible semiconductor device
- Patent number 8,975,626
- Issue date Mar 10, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing flexible semiconductor device having gate...
- Patent number 8,895,373
- Issue date Nov 25, 2014
- Panasonic Corporation
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure and method for forming bump
- Patent number 8,887,383
- Issue date Nov 18, 2014
- Panasonic Corporation
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible semiconductor device having gate electrode disposed within...
- Patent number 8,581,247
- Issue date Nov 12, 2013
- Panasonic Corporation
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump forming method using self-assembling resin and a wall surface
- Patent number 8,297,488
- Issue date Oct 30, 2012
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BATTERY NEGATIVE ELECTRODE MATERIAL, METHOD FOR MANUFACTURING SAME,...
- Publication number 20210242448
- Publication date Aug 5, 2021
- Kureha Corporation
- Makoto IMAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY NEGATIVE ELECTRODE MATERIAL, METHOD FOR MANUFACTURING SAME,...
- Publication number 20190221835
- Publication date Jul 18, 2019
- Kureha Corporation
- Makoto IMAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIVE ELECTRODE PLATES FOR NONAQUEOUS ELECTROLYTE SECONDARY BATT...
- Publication number 20180013173
- Publication date Jan 11, 2018
- PANASONIC CORPORATION
- Hiroshi Kawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE ELECTRODE MATERIAL INCLUDING COMPOSITE PARTICLES, AND METH...
- Publication number 20170373307
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- DAISUKE KATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE ELECTRODE MATERIAL INCLUDING COMPOSITE PARTICLES, AND METH...
- Publication number 20170373308
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- DAISUKE KATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE HAVING GATE...
- Publication number 20140038366
- Publication date Feb 6, 2014
- PANASONIC CORPORATION
- Takeshi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20120001173
- Publication date Jan 5, 2012
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110042677
- Publication date Feb 24, 2011
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP
- Publication number 20100044091
- Publication date Feb 25, 2010
- PANASONIC CORPORATION
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
- Publication number 20090078746
- Publication date Mar 26, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component Mounted Body, Electronic Component with Solder...
- Publication number 20090008776
- Publication date Jan 8, 2009
- Takashi Kitae
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kenichi HOTEHAMA

Person

Patents Grantslast 30 patents

Negative electrode material including composite particles, and meth...

Positive electrode plates for nonaqueous electrolyte secondary batt...

Negative electrode material including composite particles, and meth...

Flexible semiconductor device

Method for manufacturing flexible semiconductor device having gate...

Electrode structure and method for forming bump

Flexible semiconductor device having gate electrode disposed within...

Bump forming method using self-assembling resin and a wall surface

Patents Applicationslast 30 patents

BATTERY NEGATIVE ELECTRODE MATERIAL, METHOD FOR MANUFACTURING SAME,...

BATTERY NEGATIVE ELECTRODE MATERIAL, METHOD FOR MANUFACTURING SAME,...

POSITIVE ELECTRODE PLATES FOR NONAQUEOUS ELECTROLYTE SECONDARY BATT...

NEGATIVE ELECTRODE MATERIAL INCLUDING COMPOSITE PARTICLES, AND METH...

NEGATIVE ELECTRODE MATERIAL INCLUDING COMPOSITE PARTICLES, AND METH...

METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE HAVING GATE...

FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP

BUMP FORMING METHOD AND BUMP FORMING APPARATUS

Electronic Component Mounted Body, Electronic Component with Solder...