Kenichi Ishikawa

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor integrated circuit with TSV bumps
- Patent number 9,305,891
- Issue date Apr 5, 2016
- Renesas Electronics Corporation
- Kenichi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit with TSV bumps
- Patent number 8,994,110
- Issue date Mar 31, 2015
- Renesas Electronics Corporation
- Kenichi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit including plurality of bonding pads
- Patent number 8,115,325
- Issue date Feb 14, 2012
- Renesas Electronics Corporation
- Kenichi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT WITH TSV BUMPS
- Publication number 20150145053
- Publication date May 28, 2015
- Renesas Electronics Corporation
- Kenichi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT WITH TSV BUMPS
- Publication number 20140145266
- Publication date May 29, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenichi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit
- Publication number 20090315191
- Publication date Dec 24, 2009
- NEC Electronics Corporation
- Kenichi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS