Kenichi Iwasaki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a plurality of cut marks on a substrate
- Patent number 9,117,898
- Issue date Aug 25, 2015
- Disco Corporation
- Kenichi Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING METHOD FOR PACKAGE SUBSTRATE
- Publication number 20150155205
- Publication date Jun 4, 2015
- Disco Corporation
- Kenichi Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer dividing method
- Publication number 20060148211
- Publication date Jul 6, 2006
- DISCO CORPORATION
- Kenichi Iwasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR