Kenichi Kamiyama

Person

Shimodate-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 8,815,334
- Issue date Aug 26, 2014
- Hitachi Chemical Co., Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation method of metal layer on resin layer, printed wiring boar...
- Patent number 7,964,289
- Issue date Jun 21, 2011
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 7,862,889
- Issue date Jan 4, 2011
- Hitachi Chemical Co., Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation method of metal layer on resin layer
- Patent number 7,818,877
- Issue date Oct 26, 2010
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 7,629,045
- Issue date Dec 8, 2009
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation method of metal layer on resin layer, printed wiring boar...
- Patent number 7,615,277
- Issue date Nov 10, 2009
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...
- Publication number 20100051338
- Publication date Mar 4, 2010
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20100044086
- Publication date Feb 25, 2010
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...
- Publication number 20090145766
- Publication date Jun 11, 2009
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20080138505
- Publication date Jun 12, 2008
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20070277373
- Publication date Dec 6, 2007
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Publication number 20050202261
- Publication date Sep 15, 2005
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Formation method of metal layer on resin layer, printed wiring boar...
- Publication number 20050106370
- Publication date May 19, 2005
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kenichi Kamiyama

Person

Patents Grantslast 30 patents

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Formation method of metal layer on resin layer, printed wiring boar...

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Formation method of metal layer on resin layer

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Formation method of metal layer on resin layer, printed wiring boar...

Patents Applicationslast 30 patents

ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Formation method of metal layer on resin layer, printed wiring boar...