Kenichi Kasai

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sealing structure for multi-chip module
- Patent number 7,518,233
- Issue date Apr 14, 2009
- Hitachi, Ltd.
- Kouichi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,890,799
- Issue date May 10, 2005
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,528,878
- Issue date Mar 4, 2003
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for cooling multi-chip modules
- Patent number 6,351,384
- Issue date Feb 26, 2002
- Hitachi, Ltd.
- Takahiro Daikoku
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device and multi-pin connector therefor
- Patent number 6,213,786
- Issue date Apr 10, 2001
- Hitachi, Ltd.
- Kiyoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin connector
- Patent number 6,132,221
- Issue date Oct 17, 2000
- Hitachi, Ltd.
- Kiyoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-cooled electronic device
- Patent number 5,959,351
- Issue date Sep 28, 1999
- Hitachi, Ltd.
- Shigeyuki Sasaki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Surface mounting structure
- Patent number 5,926,375
- Issue date Jul 20, 1999
- Hitachi, Ltd.
- Hideki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin contact and electric parts having the same
- Patent number 5,888,106
- Issue date Mar 30, 1999
- Hitachi, Ltd.
- Takayuki Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module with heat sink and attachment means
- Patent number 5,844,311
- Issue date Dec 1, 1998
- Hitachi, Ltd.
- Hideki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low thermal resistant, fluid-cooled semiconductor module
- Patent number 5,774,334
- Issue date Jun 30, 1998
- Hitachi, Ltd.
- Keizo Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device of multi-chip module
- Patent number 5,751,062
- Issue date May 12, 1998
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multi-pin connector
- Patent number 5,743,009
- Issue date Apr 28, 1998
- Hitachi, Ltd.
- Kiyoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 5,705,850
- Issue date Jan 6, 1998
- Hitachi, Ltd.
- Noriyuki Ashiwake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 5,592,363
- Issue date Jan 7, 1997
- Hitachi, Ltd.
- Takayuki Atarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus for electronic equipment
- Patent number 5,504,651
- Issue date Apr 2, 1996
- Hitachi Chemical Co., Ltd.
- Takayuki Atarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling semiconductor device and computer having the...
- Patent number 5,406,807
- Issue date Apr 18, 1995
- Hitachi, Ltd.
- Noriyuki Ashiwake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid impingement cooling module for semiconductor devices
- Patent number 5,270,572
- Issue date Dec 14, 1993
- Hitachi, Ltd.
- Tadakatsu Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor cooling apparatus
- Patent number 4,977,444
- Issue date Dec 11, 1990
- Hitachi, Ltd.
- Tadakatsu Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor cooling apparatus and cooling method thereof
- Patent number 4,949,164
- Issue date Aug 14, 1990
- Hitachi, Ltd.
- Shigeo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrel type centrifugal turbo-machine
- Patent number 4,218,181
- Issue date Aug 19, 1980
- Hitachi, Ltd.
- Kazuhiro Komatsu
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...

Patents Applicationslast 30 patents

Information Patent Application
Device for sealing and cooling multi-chip modules
- Publication number 20030103333
- Publication date Jun 5, 2003
- Hitachi, Ltd
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS

Kenichi Kasai

Person

Patents Grantslast 30 patents

Sealing structure for multi-chip module

Device for sealing and cooling multi-chip modules

Device for sealing and cooling multi-chip modules

Device and method for cooling multi-chip modules

Electronic device and multi-pin connector therefor

Multi-pin connector

Liquid-cooled electronic device

Surface mounting structure

Pin contact and electric parts having the same

Multichip module with heat sink and attachment means

Low thermal resistant, fluid-cooled semiconductor module

Cooling device of multi-chip module

Method of making multi-pin connector

Semiconductor module

Electronic apparatus

Cooling apparatus for electronic equipment

Apparatus for cooling semiconductor device and computer having the...

Liquid impingement cooling module for semiconductor devices

Semiconductor cooling apparatus

Semiconductor cooling apparatus and cooling method thereof

Barrel type centrifugal turbo-machine

Patents Applicationslast 30 patents

Device for sealing and cooling multi-chip modules