Kenichi Moriyama

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Surface treatment agent for copper and copper alloy
- Patent number 7,232,528
- Issue date Jun 19, 2007
- Mitsubishi Gas Chemical Company, Inc.
- Akira Hosomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for producing thin copper foil-clad circuit board substrate
- Patent number 5,242,540
- Issue date Sep 7, 1993
- Mitsubishi Gas Chemical Co., Inc.
- Kenji Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Surface treatment agent for copper and copper alloy
- Publication number 20050061202
- Publication date Mar 24, 2005
- Akira Hosomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...