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Kenichi OGAWA
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Tokyo-to, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Wiring board and method for manufacturing wiring board
Patent number
12,144,108
Issue date
Nov 12, 2024
Dai Nippon Printing Co., Ltd.
Naoko Okimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing wiring board with a meandering shape section
Patent number
11,968,777
Issue date
Apr 23, 2024
Dai Nippon Printing Co., Ltd.
Kenichi Ogawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and method for manufacturing wiring board
Patent number
11,778,737
Issue date
Oct 3, 2023
Dai Nippon Printing Co., Ltd.
Naoko Okimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and method for manufacturing wiring board
Patent number
11,744,011
Issue date
Aug 29, 2023
Dai Nippon Printing Co., Ltd.
Kenichi Ogawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and method for manufacturing wiring board
Patent number
11,653,444
Issue date
May 16, 2023
Dai Nippon Printing Co., Ltd.
Naoko Okimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and method for manufacturing wiring board
Patent number
11,612,054
Issue date
Mar 21, 2023
Dai Nippon Printing Co., Ltd.
Naoko Okimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and method for manufacturing the wiring board
Patent number
11,395,404
Issue date
Jul 19, 2022
Dai Nippon Printing Co., Ltd.
Naoko Okimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and method for manufacturing wiring board
Patent number
11,284,507
Issue date
Mar 22, 2022
Dai Nippon Printing Co., Ltd.
Kenichi Ogawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stretchable circuit substrate and article
Patent number
11,172,570
Issue date
Nov 9, 2021
Dai Nippon Printing Co., Ltd.
Naoko Okimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and method for manufacturing wiring board
Patent number
11,109,479
Issue date
Aug 31, 2021
Dai Nippon Printing Co., Ltd.
Naoko Okimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stretchable circuit substrate and article
Patent number
10,959,326
Issue date
Mar 23, 2021
Dai Nippon Printing Co., Ltd.
Naoko Okimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing twist ball type electronic paper
Patent number
8,840,747
Issue date
Sep 23, 2014
Dai Nippon Printing Co., Ltd.
Kenichi Ogawa
G02 - OPTICS
Information
Patent Grant
Method for manufacturing a pattern formed body, method for manufact...
Patent number
8,440,518
Issue date
May 14, 2013
Dai Nippon Printing Co., Ltd.
Kenichi Ogawa
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Patents Applications
last 30 patents
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Publication number
20220210912
Publication date
Jun 30, 2022
DAI NIPPON PRINTING CO., LTD.
Kenichi OGAWA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Publication number
20220183150
Publication date
Jun 9, 2022
DAI NIPPON PRINTING CO., LTD.
Naoko OKIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Publication number
20220015228
Publication date
Jan 13, 2022
DAI NIPPON PRINTING CO., LTD.
Naoko OKIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Publication number
20220015227
Publication date
Jan 13, 2022
DAI NIPPON PRINTING CO., LTD.
Kenichi OGAWA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE WIRING BOARD
Publication number
20210410280
Publication date
Dec 30, 2021
DAI NIPPON PRINTING CO., LTD.
Naoko OKIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Publication number
20210385946
Publication date
Dec 9, 2021
DAI NIPPON PRINTING CO., LTD.
Naoko OKIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STRETCHABLE CIRCUIT SUBSTRATE AND ARTICLE
Publication number
20210176858
Publication date
Jun 10, 2021
DAI NIPPON PRINTING CO., LTD.
Naoko OKIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Publication number
20200281074
Publication date
Sep 3, 2020
DAI NIPPON PRINTING CO., LTD.
Naoko OKIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Publication number
20200281073
Publication date
Sep 3, 2020
DAI NIPPON PRINTING CO., LTD.
Naoko OKIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STRETCHABLE CIRCUIT SUBSTRATE AND ARTICLE
Publication number
20200267835
Publication date
Aug 20, 2020
DAI NIPPON PRINTING CO., LTD.
Naoko OKIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Publication number
20200260573
Publication date
Aug 13, 2020
DAI NIPPON PRINTING CO., LTD.
Kenichi OGAWA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
TWIST BALL TYPE ELECTRONIC PAPER
Publication number
20120275014
Publication date
Nov 1, 2012
SOKEN CHEMICAL & ENGINEERING CO., LTD.
Kenichi Ogawa
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
METHOD FOR MANUFACTURING TWIST BALL TYPE ELECTRONIC PAPER
Publication number
20120267044
Publication date
Oct 25, 2012
DAI NIPPON PRINTING CO., LTD.
Kenichi Ogawa
G02 - OPTICS
Information
Patent Application
METHOD FOR MANUFACTURING A PATTERN FORMED BODY, METHOD FOR MANUFACT...
Publication number
20110244639
Publication date
Oct 6, 2011
DAI NIPPON PRINTING CO., LTD.
Kenichi OGAWA
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY