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Kenichi Otake
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Tokyo, JP
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last 30 patents
Information
Patent Grant
Structure and method for mounting a saw device
Patent number
6,078,123
Issue date
Jun 20, 2000
NEC Corporation
Kei Tanaka
G01 - MEASURING TESTING
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Patent Grant
Semiconductor package with flexible board and method of fabricating...
Patent number
5,805,422
Issue date
Sep 8, 1998
NEC Corporation
Kenichi Otake
H01 - BASIC ELECTRIC ELEMENTS