Kenichi Otake

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Fukuoka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding tool for component
- Patent number 6,543,669
- Issue date Apr 8, 2003
- Matsushita Electric Industrial Co., Ltd.
- Seiji Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding tool for component
- Patent number 6,497,354
- Issue date Dec 24, 2002
- Matsushita Electric Industrial Co., Ltd.
- Seiji Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mounting a chip
- Patent number 5,839,187
- Issue date Nov 24, 1998
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING TOOL FOR COMPONENT
- Publication number 20030038158
- Publication date Feb 27, 2003
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding apparatus and bonding tool for component
- Publication number 20020066767
- Publication date Jun 6, 2002
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS