Kenichi Shirasaka

Person

Hamamatsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for magnetic sensor and lead frame therefor
- Patent number 8,138,757
- Issue date Mar 20, 2012
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Grant
Lead frame having a die stage smaller than a semiconductor device a...
- Patent number 7,964,942
- Issue date Jun 21, 2011
- Yamaha Corporation
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical quantity sensor, lead frame, and manufacturing method ther...
- Patent number 7,867,827
- Issue date Jan 11, 2011
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lead frame, sensor including lead frame and method of forming senso...
- Patent number 7,829,982
- Issue date Nov 9, 2010
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Grant
Physical quantity sensor and lead frame used for same
- Patent number 7,791,180
- Issue date Sep 7, 2010
- Yamaha Corporation
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing physical quantity sensor
- Patent number 7,754,130
- Issue date Jul 13, 2010
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Grant
Physical quantity sensor and manufacturing method therefor
- Patent number 7,727,793
- Issue date Jun 1, 2010
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 7,607,355
- Issue date Oct 27, 2009
- Yamaha Corporation
- Kenichi Shirasaka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Physical quantity sensor and manufacturing method therefor
- Patent number 7,595,548
- Issue date Sep 29, 2009
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and package, and method of manufacturer therefor
- Patent number 7,554,182
- Issue date Jun 30, 2009
- Yamaha Corporation
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a magnetic sensor
- Patent number 7,541,665
- Issue date Jun 2, 2009
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and semiconductor package mounting method
- Patent number 7,541,294
- Issue date Jun 2, 2009
- Yamaha Corporation
- Kenichi Shirasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor including lead frame and method of forming sensor including...
- Patent number 7,524,696
- Issue date Apr 28, 2009
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method for magnetic sensor and lead frame therefor
- Patent number 7,494,838
- Issue date Feb 24, 2009
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and lead frame therefor
- Patent number 7,397,112
- Issue date Jul 8, 2008
- Yamaha Corporation
- Takashi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacture and inspection of semiconducto...
- Patent number 7,319,042
- Issue date Jan 15, 2008
- Yamaha Corporation
- Kenichi Shirasaka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Physical quantity sensor, lead frame, and manufacturing method ther...
- Patent number 7,290,448
- Issue date Nov 6, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a semiconductor package using a lead frame...
- Patent number 7,195,953
- Issue date Mar 27, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for magnetic sensor and lead frame therefor
- Patent number 7,187,063
- Issue date Mar 6, 2007
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and package, and method of manufacture therefor
- Patent number 7,170,149
- Issue date Jan 30, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor package mounting method
- Patent number 6,979,910
- Issue date Dec 27, 2005
- Yamaha Corporation
- Kenichi Shirasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and semiconductor package mounting method
- Patent number 6,861,282
- Issue date Mar 1, 2005
- Yamaha Corporation
- Kenichi Shirasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Lead frame and package of semiconductor device
- Publication number 20090243058
- Publication date Oct 1, 2009
- Yamaha Corporation
- Kenichi Shirasaka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Microphone package, lead frame, mold substrate, and mounting struct...
- Publication number 20090175479
- Publication date Jul 9, 2009
- Yamaha Corporation
- Kenichi Shirasaka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device, lead frame, and microphone package therefor
- Publication number 20090065882
- Publication date Mar 12, 2009
- Yamaha Corporation
- Kenichi Shirasaka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Microphone package adapted to semiconductor device and manufacturin...
- Publication number 20080310663
- Publication date Dec 18, 2008
- Yamaha Corporation
- Kenichi Shirasaka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device
- Publication number 20080229840
- Publication date Sep 25, 2008
- Yamaha Corporation
- Kenichi Shirasaka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE THEREFOR
- Publication number 20080191325
- Publication date Aug 14, 2008
- Yamaha Corporation
- Kenichi Shirasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME HAVING A DIE STAGE SMALLER THAN A SEMICONDUCTOR DEVICE A...
- Publication number 20080073764
- Publication date Mar 27, 2008
- Yamaha Corporation
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL QUANTITY SENSOR, LEAD FRAME, AND MANUFACTURING METHOD THER...
- Publication number 20080038875
- Publication date Feb 14, 2008
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING A LEAD FRAME...
- Publication number 20070292994
- Publication date Dec 20, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for manufacture and inspection of semiconducto...
- Publication number 20070264756
- Publication date Nov 15, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Physical Quantity Sensor and Lead Frame Used for Same
- Publication number 20070220988
- Publication date Sep 27, 2007
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PHYSICAL QUANTITY SENSOR
- Publication number 20070184584
- Publication date Aug 9, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Application
Method of manufacturing a semiconductor package using lead frame ha...
- Publication number 20070126089
- Publication date Jun 7, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for magnetic sensor and lead frame therefor
- Publication number 20070099349
- Publication date May 3, 2007
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Application
Physical quantity sensor and manufacturing method therefor
- Publication number 20070028685
- Publication date Feb 8, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and package, and method of manufacturer therefor
- Publication number 20070001275
- Publication date Jan 4, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Physical quantity sensor, lead frame, and manufacturing method ther...
- Publication number 20060278027
- Publication date Dec 14, 2006
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing a semiconductor package using a lead frame...
- Publication number 20060228833
- Publication date Oct 12, 2006
- Kenichi Shirasaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for magnetic sensor and lead frame therefor
- Publication number 20060220193
- Publication date Oct 5, 2006
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Application
Manufacturing method for physical quantity sensor using lead frame...
- Publication number 20060211176
- Publication date Sep 21, 2006
- Shiga International
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Application
Sensor including lead frame and method of forming sensor including...
- Publication number 20060194362
- Publication date Aug 31, 2006
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Application
Lead frame, sensor including lead frame and method of forming senso...
- Publication number 20060186529
- Publication date Aug 24, 2006
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Application
Lead frame, sensor including lead frame, resin composition to be us...
- Publication number 20060185452
- Publication date Aug 24, 2006
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor package and lead frame therefor
- Publication number 20060138615
- Publication date Jun 29, 2006
- Yamaha Corporation
- Takashi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Physical quantity sensor and manufacturing method therefor
- Publication number 20060087006
- Publication date Apr 27, 2006
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Lead frame and semiconductor package therefor
- Publication number 20060071307
- Publication date Apr 6, 2006
- Yamaha Corporation
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and semiconductor package mounting method
- Publication number 20060060948
- Publication date Mar 23, 2006
- Yamaha Corporation
- Kenichi Shirasaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Physical quantity sensor, lead frame, and manufacturing method ther...
- Publication number 20060053909
- Publication date Mar 16, 2006
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Manufacturing method for magnetic sensor and lead frame therefor
- Publication number 20060006863
- Publication date Jan 12, 2006
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Application
Lead frame and semiconductor device using the same
- Publication number 20050006733
- Publication date Jan 13, 2005
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS

Kenichi Shirasaka

Person

Patents Grantslast 30 patents

Manufacturing method for magnetic sensor and lead frame therefor

Lead frame having a die stage smaller than a semiconductor device a...

Physical quantity sensor, lead frame, and manufacturing method ther...

Lead frame, sensor including lead frame and method of forming senso...

Physical quantity sensor and lead frame used for same

Method for manufacturing physical quantity sensor

Physical quantity sensor and manufacturing method therefor

Semiconductor device

Physical quantity sensor and manufacturing method therefor

Semiconductor device and package, and method of manufacturer therefor

Lead frame for a magnetic sensor

Semiconductor package and semiconductor package mounting method

Sensor including lead frame and method of forming sensor including...

Manufacturing method for magnetic sensor and lead frame therefor

Semiconductor package and lead frame therefor

Method and apparatus for manufacture and inspection of semiconducto...

Physical quantity sensor, lead frame, and manufacturing method ther...

Method of manufacturing a semiconductor package using a lead frame...

Manufacturing method for magnetic sensor and lead frame therefor

Semiconductor device and package, and method of manufacture therefor

Semiconductor package and semiconductor package mounting method

Semiconductor package and semiconductor package mounting method

Patents Applicationslast 30 patents

Lead frame and package of semiconductor device

Microphone package, lead frame, mold substrate, and mounting struct...

Semiconductor device, lead frame, and microphone package therefor

Microphone package adapted to semiconductor device and manufacturin...

Semiconductor device

SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE THEREFOR

LEAD FRAME HAVING A DIE STAGE SMALLER THAN A SEMICONDUCTOR DEVICE A...

PHYSICAL QUANTITY SENSOR, LEAD FRAME, AND MANUFACTURING METHOD THER...

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING A LEAD FRAME...

Method and apparatus for manufacture and inspection of semiconducto...

Physical Quantity Sensor and Lead Frame Used for Same

METHOD FOR MANUFACTURING PHYSICAL QUANTITY SENSOR

Method of manufacturing a semiconductor package using lead frame ha...

Manufacturing method for magnetic sensor and lead frame therefor

Physical quantity sensor and manufacturing method therefor

Semiconductor device and package, and method of manufacturer therefor

Physical quantity sensor, lead frame, and manufacturing method ther...

Method of manufacturing a semiconductor package using a lead frame...

Manufacturing method for magnetic sensor and lead frame therefor

Manufacturing method for physical quantity sensor using lead frame...

Sensor including lead frame and method of forming sensor including...

Lead frame, sensor including lead frame and method of forming senso...

Lead frame, sensor including lead frame, resin composition to be us...

Semiconductor package and lead frame therefor

Physical quantity sensor and manufacturing method therefor

Lead frame and semiconductor package therefor

Semiconductor package and semiconductor package mounting method

Physical quantity sensor, lead frame, and manufacturing method ther...

Manufacturing method for magnetic sensor and lead frame therefor

Lead frame and semiconductor device using the same