Kenichi Ueno

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Fujisawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for copper-plating a wafer using an anode having an iridium...
- Patent number 6,432,293
- Issue date Aug 13, 2002
- Permelec Electrode Ltd.
- Setsuro Ogata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of copper plating
- Patent number 5,143,593
- Issue date Sep 1, 1992
- Permelec Electrode Ltd.
- Kenichi Ueno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Horizontal carrying tape electroplating apparatus
- Patent number 5,102,521
- Issue date Apr 7, 1992
- Almex Inc.
- Hitoshi Usuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR EXFOLIATING COATING LAYER OF ELECTRODE FOR ELECTROLYSIS
- Publication number 20140305468
- Publication date Oct 16, 2014
- Nobuyuki Kawaguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR