Kenichi Yokoyama

Person

Nagoya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pressure sensor
- Patent number 11,940,347
- Issue date Mar 26, 2024
- Denso Corporation
- Hiroshi Kodama
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor physical quantity sensor and method for manufacturing...
- Patent number 7,838,320
- Issue date Nov 23, 2010
- Denso Corporation
- Kenichi Yokoyama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor and method for manufacturing the same
- Patent number 7,821,085
- Issue date Oct 26, 2010
- Denso Corporation
- Shigenori Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for positioning dicing line of wafer
- Patent number 7,763,525
- Issue date Jul 27, 2010
- Denso Corporation
- Keisuke Goto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for separating a semiconductor substrate into a plurality of...
- Patent number 7,662,668
- Issue date Feb 16, 2010
- Denso Corporation
- Kazuhiko Sugiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor sensor
- Patent number 7,598,118
- Issue date Oct 6, 2009
- Denso Corporation
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor physical quantity sensor and method for manufacturing...
- Patent number 7,505,245
- Issue date Mar 17, 2009
- Denso Corporation
- Kenichi Yokoyama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor and method for manufacturing the same
- Patent number 7,418,864
- Issue date Sep 2, 2008
- Denso Corporation
- Kazushi Asami
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor having multiple through holes
- Patent number 7,337,670
- Issue date Mar 4, 2008
- Denso Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Grant
Physical quantity sensor having multiple through holes
- Patent number 7,178,400
- Issue date Feb 20, 2007
- Denso Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor substrate manufacturing method, semiconductor pressur...
- Patent number 6,388,279
- Issue date May 14, 2002
- Denso Corporation
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor with a built-in amplification circuit
- Patent number 5,770,883
- Issue date Jun 23, 1998
- Nippondenso Co., Ltd.
- Koki Mizuno
- G01 - MEASURING TESTING
Information Patent Grant
Sunlight sensor
- Patent number 5,594,236
- Issue date Jan 14, 1997
- Nippondenso Co., Ltd.
- Yasutoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SENSOR
- Publication number 20220042868
- Publication date Feb 10, 2022
- DENSO CORPORATION
- Hiroshi KODAMA
- G01 - MEASURING TESTING
Information Patent Application
Physical quantity sensor and method for manufacturing the same
- Publication number 20090261430
- Publication date Oct 22, 2009
- DENSO CORPORATION
- Shigenori Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor physical quantity sensor and method for manufacturing...
- Publication number 20090243005
- Publication date Oct 1, 2009
- DENSO CORPORATION
- Kenichi Yokoyama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Physical quantity sensor having multiple through holes
- Publication number 20070120205
- Publication date May 31, 2007
- DENSO CORPORATION
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Application
Method of manufacturing semiconductor sensor
- Publication number 20070117260
- Publication date May 24, 2007
- DENSO CORPORATION
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Separating device for separating semiconductor substrate and method...
- Publication number 20070111476
- Publication date May 17, 2007
- DENSO CORPORATION
- Kazuhiko Sugiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Acceleration sensor and method for manufacturing the same
- Publication number 20060213268
- Publication date Sep 28, 2006
- DENSO CORPORATION
- Kazushi Asami
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor physical quantity sensor and method for manufacturing...
- Publication number 20060057758
- Publication date Mar 16, 2006
- DENSO Corporation
- Kenichi Yokoyama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for positioning dicing line of wafer
- Publication number 20060024920
- Publication date Feb 2, 2006
- DENSO Corporation
- Keisuke Goto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Physical quantity sensor having multiple through holes
- Publication number 20050229704
- Publication date Oct 20, 2005
- DENSO Corporation
- Minoru Murata
- G01 - MEASURING TESTING

Kenichi Yokoyama

Person

Patents Grantslast 30 patents

Pressure sensor

Semiconductor physical quantity sensor and method for manufacturing...

Physical quantity sensor and method for manufacturing the same

Method for positioning dicing line of wafer

Method for separating a semiconductor substrate into a plurality of...

Method of manufacturing semiconductor sensor

Semiconductor physical quantity sensor and method for manufacturing...

Acceleration sensor and method for manufacturing the same

Physical quantity sensor having multiple through holes

Physical quantity sensor having multiple through holes

Semiconductor substrate manufacturing method, semiconductor pressur...

Semiconductor sensor with a built-in amplification circuit

Sunlight sensor

Patents Applicationslast 30 patents

PRESSURE SENSOR

Physical quantity sensor and method for manufacturing the same

Semiconductor physical quantity sensor and method for manufacturing...

Physical quantity sensor having multiple through holes

Method of manufacturing semiconductor sensor

Separating device for separating semiconductor substrate and method...

Acceleration sensor and method for manufacturing the same

Semiconductor physical quantity sensor and method for manufacturing...

Method for positioning dicing line of wafer

Physical quantity sensor having multiple through holes