Kenichiro Nishi

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Signal processing device and signal processing method for correctin...
- Patent number 11,985,424
- Issue date May 14, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroshi Arai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Signal processing device, signal processing method, and parameter s...
- Patent number 11,785,340
- Issue date Oct 10, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroshi Arai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for chamfering a wafer
- Patent number 6,302,769
- Issue date Oct 16, 2001
- Nippei Toyama Corporation
- Kenichiro Nishi
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding method, surface grinder, workpiece support, mechanism and...
- Patent number 6,296,553
- Issue date Oct 2, 2001
- Nippei Toyama Corporation
- Kenichiro Nishi
- B24 - GRINDING POLISHING
Information Patent Grant
Feeding a grinding wheel in grinding method
- Patent number 6,220,931
- Issue date Apr 24, 2001
- Nippei Toyama Corporation
- Kenichiro Nishi
- B24 - GRINDING POLISHING
Information Patent Grant
Ingot slicing method, an ingot manufacturing method and a sliced in...
- Patent number 6,113,489
- Issue date Sep 5, 2000
- Nippei Toyama Corporation
- Kenichiro Nishi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Grinder and grinding method
- Patent number 6,036,585
- Issue date Mar 14, 2000
- Nippei Toyama Corporation
- Kenichiro Nishi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL PROCESSING DEVICE AND SIGNAL PROCESSING METHOD
- Publication number 20230156331
- Publication date May 18, 2023
- Sony Semiconductor Solutions Corporation
- Hiroshi ARAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SIGNAL PROCESSING DEVICE, SIGNAL PROCESSING METHOD, AND PARAMETER S...
- Publication number 20230135628
- Publication date May 4, 2023
- Sony Semiconductor Solutions Corporation
- Hiroshi ARAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SIGNAL PROCESSING APPARATUS, SIGNAL PROCESSING METHOD, AND PROGRAM
- Publication number 20230108850
- Publication date Apr 6, 2023
- Sony Semiconductor Solutions Corporation
- Hiroshi ARAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR CHAMFERING A WAFER
- Publication number 20010041513
- Publication date Nov 15, 2001
- NISHI AND MURAI
- KENICHIRO NISHI
- B24 - GRINDING POLISHING

Kenichiro Nishi

Person

Patents Grantslast 30 patents

Signal processing device and signal processing method for correctin...

Signal processing device, signal processing method, and parameter s...

Method for chamfering a wafer

Grinding method, surface grinder, workpiece support, mechanism and...

Feeding a grinding wheel in grinding method

Ingot slicing method, an ingot manufacturing method and a sliced in...

Grinder and grinding method

Patents Applicationslast 30 patents

SIGNAL PROCESSING DEVICE AND SIGNAL PROCESSING METHOD

SIGNAL PROCESSING DEVICE, SIGNAL PROCESSING METHOD, AND PARAMETER S...

SIGNAL PROCESSING APPARATUS, SIGNAL PROCESSING METHOD, AND PROGRAM

METHOD FOR CHAMFERING A WAFER