Kenichiro Suetsugu

Person

Amagasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder material and connected structure
- Patent number 9,656,351
- Issue date May 23, 2017
- Hiroshima University
- Kazuhiro Matsugi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering material and electronic component assembly
- Patent number 8,598,464
- Issue date Dec 3, 2013
- Panasonic Corporation
- Shigeaki Sakatani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material, electronic component, bonding structure and elect...
- Patent number 8,227,090
- Issue date Jul 24, 2012
- Panasonic Corporation
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow soldering apparatus and flow soldering method using a water co...
- Patent number 8,132,707
- Issue date Mar 13, 2012
- Panasonic Corporation
- Kimiaki Nakaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering apparatus and soldering method
- Patent number 7,780,057
- Issue date Aug 24, 2010
- Panasonic Corporation
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for recycling wastes of an electrical appliance
- Patent number 7,540,078
- Issue date Jun 2, 2009
- Panasonic Corporation
- Kenichiro Suetsugu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method and apparatus for processing electronic parts
- Patent number 7,176,402
- Issue date Feb 13, 2007
- Matsushita Electric Industrial Co., Ltd.
- Tomohiro Okumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting material and connecting method
- Patent number 7,047,635
- Issue date May 23, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow soldering process and apparatus
- Patent number 6,805,282
- Issue date Oct 19, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuji Kawashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of soldering using lead-free solder and bonded article prepa...
- Patent number 6,702,175
- Issue date Mar 9, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Matsushige
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and electronic circuit board
- Patent number 6,657,135
- Issue date Dec 2, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for estimating quality of lead-free solder mat...
- Patent number 6,607,116
- Issue date Aug 19, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder, solder paste and soldering method
- Patent number 6,428,745
- Issue date Aug 6, 2002
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy of electrode for joining electronic parts and solderin...
- Patent number 6,325,279
- Issue date Dec 4, 2001
- Matsushita Electric Industrial, Co., Ltd.
- Yoshinori Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder, solder paste and soldering method
- Patent number 6,267,823
- Issue date Jul 31, 2001
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy of electrode for joining electronic parts and solderin...
- Patent number 6,077,477
- Issue date Jun 20, 2000
- Matsushita Electric Industrial Co., Ltd.
- Yoshinori Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method of semiconductor device
- Patent number 6,074,894
- Issue date Jun 13, 2000
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a resin-encapsulated electronic product
- Patent number 6,052,893
- Issue date Apr 25, 2000
- Matsushita Electric Industrial Co., Ltd.
- Koichi Yoshida
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Solder, electronic component mounted by soldering, and electronic c...
- Patent number 5,962,133
- Issue date Oct 5, 1999
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit substrate
- Patent number 5,858,481
- Issue date Jan 12, 1999
- Matsushita Electric Industrial Co., Ltd.
- Tetsuo Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting electronics component
- Patent number 5,743,007
- Issue date Apr 28, 1998
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Onishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding film member and mounting method of electronic component
- Patent number 5,498,575
- Issue date Mar 12, 1996
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Onishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image reading device having a light waveguide means widened toward...
- Patent number 5,198,655
- Issue date Mar 30, 1993
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor having light guides for communication with image plane
- Patent number 5,136,150
- Issue date Aug 4, 1992
- Matsushita Electric Industrial Co., Ltd.
- Tetsuo Fukushima
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for molding an article integrated with a multi-layer flexibl...
- Patent number 5,118,458
- Issue date Jun 2, 1992
- Matsushita Electric Industrial Co., Ltd.
- Munekazu Nishihara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical wave guide sheet comprising plurality of doubly-clad core m...
- Patent number 5,113,470
- Issue date May 12, 1992
- Matsushita Electric Industrial Co., Ltd.
- Tetsuo Fukushima
- G02 - OPTICS
Information Patent Grant
Optical waveguide and an image sensor using the same
- Patent number 5,052,776
- Issue date Oct 1, 1991
- Matsushita Electric Industrial Co., Ltd.
- Tetsuo Fukushima
- G02 - OPTICS
Information Patent Grant
Bicycle frame
- Patent number 5,037,233
- Issue date Aug 6, 1991
- Matsushita Electric Industrial Co., Ltd.
- Munekazu Nishihara
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Multiple fluid mixing apparatus
- Patent number 4,834,545
- Issue date May 30, 1989
- Matsushita Electric Industrial Co., Ltd.
- Takao Inoue
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MATERIAL AND CONNECTED STRUCTURE
- Publication number 20160354868
- Publication date Dec 8, 2016
- HIROSHIMA UNIVERSITY
- Kazuhiro Matsugi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOLDERING MATERIAL AND ELECTRONIC COMPONENT ASSEMBLY
- Publication number 20110120769
- Publication date May 26, 2011
- Shigeaki Sakatani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLOW SOLDERING APPARATUS AND FLOW SOLDERING METHOD
- Publication number 20110031297
- Publication date Feb 10, 2011
- PANASONIC CORPORATION
- Kimiaki Nakaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE
- Publication number 20100294550
- Publication date Nov 25, 2010
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECT...
- Publication number 20090242249
- Publication date Oct 1, 2009
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING APPARATUS AND SOLDERING METHOD
- Publication number 20090166398
- Publication date Jul 2, 2009
- PANASONIC CORPORATION
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARTICLE HAVING A CIRCUIT SOLDERED WITH PARTS AND METHOD FOR RECYCLI...
- Publication number 20080210604
- Publication date Sep 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method and apparatus for processing electronic parts
- Publication number 20050179171
- Publication date Aug 18, 2005
- Tomohiro Okumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of soldering lead-free solder, and joined object soldered by...
- Publication number 20040144829
- Publication date Jul 29, 2004
- Kazumi Matsushige
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonded structure and electronic circuit board
- Publication number 20020187689
- Publication date Dec 12, 2002
- Kenichiro Suetsugu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux applying method, flow soldering method and devices therefor an...
- Publication number 20020179690
- Publication date Dec 5, 2002
- Yasuji Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for flow soldering
- Publication number 20020179693
- Publication date Dec 5, 2002
- Yasuji Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting material and connecting method
- Publication number 20020022000
- Publication date Feb 21, 2002
- Kenichiro Suetsugu
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Method and apparatus for estimating quality of lead-free solder mat...
- Publication number 20020000460
- Publication date Jan 3, 2002
- Kenichiro Suetsugu
- G01 - MEASURING TESTING
Information Patent Application
Solder, solder paste and soldering method
- Publication number 20010025875
- Publication date Oct 4, 2001
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder, solder paste and soldering method
- Publication number 20010018030
- Publication date Aug 30, 2001
- Matsushita Electic Industrial Co., Ltd.
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kenichiro Suetsugu

Person

Patents Grantslast 30 patents

Solder material and connected structure

Soldering material and electronic component assembly

Bonding material, electronic component, bonding structure and elect...

Flow soldering apparatus and flow soldering method using a water co...

Soldering apparatus and soldering method

Method for recycling wastes of an electrical appliance

Method and apparatus for processing electronic parts

Connecting material and connecting method

Flow soldering process and apparatus

Method of soldering using lead-free solder and bonded article prepa...

Connection structure and electronic circuit board

Method and apparatus for estimating quality of lead-free solder mat...

Solder, solder paste and soldering method

Solder alloy of electrode for joining electronic parts and solderin...

Solder, solder paste and soldering method

Solder alloy of electrode for joining electronic parts and solderin...

Mounting method of semiconductor device

Process for manufacturing a resin-encapsulated electronic product

Solder, electronic component mounted by soldering, and electronic c...

Electronic circuit substrate

Method of mounting electronics component

Bonding film member and mounting method of electronic component

Image reading device having a light waveguide means widened toward...

Image sensor having light guides for communication with image plane

Method for molding an article integrated with a multi-layer flexibl...

Optical wave guide sheet comprising plurality of doubly-clad core m...

Optical waveguide and an image sensor using the same

Bicycle frame

Multiple fluid mixing apparatus

Patents Applicationslast 30 patents

SOLDER MATERIAL AND CONNECTED STRUCTURE

SOLDERING MATERIAL AND ELECTRONIC COMPONENT ASSEMBLY

FLOW SOLDERING APPARATUS AND FLOW SOLDERING METHOD

BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE

BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECT...

SOLDERING APPARATUS AND SOLDERING METHOD

ARTICLE HAVING A CIRCUIT SOLDERED WITH PARTS AND METHOD FOR RECYCLI...

Method and apparatus for processing electronic parts

Method of soldering lead-free solder, and joined object soldered by...

Bonded structure and electronic circuit board

Flux applying method, flow soldering method and devices therefor an...

Method and device for flow soldering

Connecting material and connecting method

Method and apparatus for estimating quality of lead-free solder mat...

Solder, solder paste and soldering method

Solder, solder paste and soldering method