Kenichirou Suetugu

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Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device using lead-free solder as die bonding material...
- Patent number 7,973,412
- Issue date Jul 5, 2011
- Panasonic Corporation
- Seiji Fujiwara
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND DIE BONDING MATERIAL
- Publication number 20090166876
- Publication date Jul 2, 2009
- PANASONIC CORPORATION
- Seiji Fujiwara
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...