Kenji Chihara

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,765,692
- Issue date Aug 3, 2010
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,594,320
- Issue date Sep 29, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 6,986,917
- Issue date Jan 17, 2006
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-circuit board and method of manufacture thereof
- Patent number 6,809,415
- Issue date Oct 26, 2004
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 6,715,204
- Issue date Apr 6, 2004
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 6,555,208
- Issue date Apr 29, 2003
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering member for printed wiring boards
- Patent number 6,358,630
- Issue date Mar 19, 2002
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 6,284,353
- Issue date Sep 4, 2001
- Ibiden Co., Ltd.
- Masaru Takada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090019693
- Publication date Jan 22, 2009
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20060042824
- Publication date Mar 2, 2006
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20030203170
- Publication date Oct 30, 2003
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20010038905
- Publication date Nov 8, 2001
- Masaru Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-circuit board and method of manufacture thereof
- Publication number 20010002728
- Publication date Jun 7, 2001
- IBIDEN CO., LTD.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS

Kenji Chihara

Person

Patents Grantslast 30 patents

Method of manufacturing printed wiring board

Method of manufacturing printed wiring board

Printed wiring board and method of manufacturing the same

Printed-circuit board and method of manufacture thereof

Printed wiring board and method for producing the same

Printed wiring board and method of manufacturing the same

Soldering member for printed wiring boards

Printed wiring board and method of manufacturing the same

Patents Applicationslast 30 patents

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Printed wiring board and method of manufacturing the same

Printed wiring board and method of manufacturing the same

Printed wiring board and method of manufacturing the same

Printed-circuit board and method of manufacture thereof